CS 2018 - Cloud Summit 2018

The IEEE Cloud Computing will be sponsoring the First IEEE Cloud Summit in Las Vegas, NV, USA from Friday January 12 to Saturday January 13, 2018. The summit is co-sponsored by the International Conference on Consumer Electronics (ICCE 2018), co-located with CES® trade show. The paper acceptance rate of Cloud Computing track in ICCE 2017 is around 30%. The Cloud Summit 2018 will continue the success of its predecessor. Academic researchers and industry practitioners are invited to present cutting-edge research and best-practices in Cloud Computing as it applies to Consumer Electronics. The goal of the Summit is to exchange ideas among all interested parties thereby leading to advancement of Cloud Computing and Consumer Electronics.
Topics of interest include, but are not limited to, the following:
Mobile Cloud with smart phones
Mobile sensing
Robotics in Cloud
Wearable device and Cloud
Hybrid Clouds
Big Data Analytics
Big Data Virtualization
Cloud Integrity
Graphics as a Service
Cloud Forensics
Privacy in Cloud
Identity Management in Cloud
PaaS, SaaS, IaaS
Submission Guidelines
Authors should submit a paper (2 or 4 pages) using EDAS. Papers should follow the standard IEEE template.
Important Dates
Papers Due: Aug 25, 2017
Paper acceptance notification: Sep 22, 2017
Camera-ready version due: Oct 1, 2017
Conference Registration:
Conference registration will open in October 2017. Please check back for registration link. Registration with the conference comes with admission ticket to the CES show (subject to changes by CES).
General Chair:
Prof. Chunming Rong, University of Stavanger, Norway
Technical Chairs:
Dr. Bingwei Liu, Aetna Inc., USA, Email: bingweiliu-AT-ieee.org
Vinayak Tanksale, Ball State University, USA, Email: vjtanksale-AT-bsu.edu
TPC Members:
Prof. Robert Hsu, Chung Hua University, Taiwan
Christine Miyachi, Xerox, USA
Bichen Zheng, OwnerIQ, Inc., USA