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TEI 2018 - Twelfth International Conference on Tangible, Embedded, and Embodied Interaction

Date2018-03-18 - 2018-03-21

Deadline2017-08-02

VenueStockholm, Sweden Sweden

Keywords

Websitehttps://tei.acm.org/2018

Topics/Call fo Papers

Twelfth International Conference on Tangible, Embedded and Embodied Interactions
March 18 – 21, Stockholm, Sweden
Submission Deadline: August 2nd, 2017
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.

Last modified: 2017-06-03 21:54:01