ICM 2017 - IEEE International Conference on Microelectronics (ICM)

The IEEE International Conference on Microelectronics (ICM) has been held in numerous countries across the Southern Europe, North Africa, and Western and Southern Asia for the past 28 years. The 29th edition of the conference will be hosted by Arts, Sciences & Technology University in Lebanon (AUL) at the Crowne Plaza Hotel, Hamra, Beirut in December 2017. Several topics will be discussed such as Circuits and Systems, CAD Tools, Micro/Nano electronics and special emerging topics.
It will include oral, poster sessions and tutorials given by experts in state-of-the-art topics. The regular technical program will run for three days. Moreover, tutorial sessions will be held on the first day of the conference.
In this context, and since the call for paper is ready to be disseminated, it’s highly appreciated to start publicizing the conference and distributing the call for paper each in his surroundings since all the arrangements for the conference have been done and the time for promoting the conference has started. Furthermore you are kindly requested to suggest names from your acquaintances to be keynote speakers in the conference as well as suggesting names for delivering tutorials. For more technical information related to the conference, please note that the website has been launched online and you can check it on the following link: www.aul.edu.lb/icm2017,
and the link to the online submission system is:
http://edas.info/N23573
Regarding the tutorial proposals kindly note that
the submission deadline will be on June 15, 2017 and
the notification on June 25, 2017.
As for the papers please note that
the full paper submission will be on July 16, 2017,
the notification of acceptance on September 18, 2017, and
the camera ready submission will be on October. 13, 2017.
Topics include but not limited to,
General Circuits and Systems
1. Analog and RF circuit design techniques
2. Digital signal and data processing
3. Wireless communication systems
4. Optical Communications
5. Nonlinear circuits
6. System on Chip (SoCs)
7. VLSI for Signal and Image Processing
8. Integrated antenna and front-end co-design
9. Signal Processing in Communications
CAD Tools and Design
1. Simulation (process, device, circuit, logic, timing, functional)
2. Layout (placement, routing, floor planning, symbolic, ERC, DRC)
3. Silicon optimization
4. Parallel embedded systems
5. Testing: Formal verification
6. CAD for FPGAs
7. High level synthesis tools
8. Design for testability
Micro/Nano electronics
1. Device characterization and modeling
2. Device physics and novel structures
3. Process technology, CMOS, BJT,
4. BiCMOS, GaAs
5. Reliability and failure analysis
6. Optoelectronics
7. MEMS Devices
8. Packaging and surface mount technology
Special Session Topic I : Virtual Reality Topic II : Biomedical Instrumentations Topic III: Renewable Energy Topic IV: Emerging Technologies
Please forward this call to your colleagues and hope to meet all of you in ICM2017, Beirut-Lebanon.