INTERCON 2017 - IEEE XXIV International Congress on Electronics, Electrical Engineering and Computing

The IEEE XXIV International Congress on Electronics, Electrical Engineering and Computing ? INTERCON 2017 invites you to submmit a full length original research contributions from engineering professionals from industries, R&D organizations, academic institutions, government departments and research scholars from across the world.
Full length original research contributions and review articles not exceeding four pages as per the IEEE double column format shall be submitted. The manuscript should contribute original research ideas, developmental ideas, analysis, findings, results, etc. The manuscript should not have been published in any journals/magazines or conference proceedings and not under review any of them. Further the manuscript should contain the name of the corresponding author with e-mail ID and affiliation of all authors. All the submitted manuscripts will be sent for peer review and the corresponding author will be notified the outcome of the review process. If reviewers recommend for further improvements in the manuscript, the manuscript will be sent back to the corresponding author and the revised version of the manuscript shall be submitted within 15 days on the date of notification.