TSP 2017 - 2017 40th International Conference on Telecommunications and Signal Processing (TSP)

The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the Conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa.
TOPICS:
TSP 2017 has opened Call for Special Session and Workshop Proposals (deadline set for February 20, 2017) and Call for Regular Full Paper Submissions with a deadline February 24, 2017. We look forward to your innovative contributions in any of the following areas:
AREA 1: Telecommunications
1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement
AREA 2: Signal Processing
6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing
For more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=121.
SPECIAL SESSIONS:
Prospective Organizers are invited to submit proposals for Special Sessions and Workshops held during the TSP 2017 Conference. The following Workshop and Special Sessions are approved so far:
WS1: 7th SPLab Workshop of Signal Processing Laboratory
SS1: Special Session on Image Processing to Diagnose, Monitor, and Control by Prof. Dan Popescu & Dr. Loretta Ichim (University Politehnica of Bucharest, Romania)
SS2: Special Session on Fractional-Order Systems; Analysis, Synthesis and Their Importance for Future Design by Assoc. Prof. Jaroslav Koton et. al (Brno University of Technology, Czech Republic) - COST Action CA15225 MC Chair
STUDENT BEST PAPER AWARD:
In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2018.
ORGANIZERS:
The TSP 2017 is IEEE technically co-sponsored Conference organized in cooperation with sixteen universities:
- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Croatia
- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland
COMMITTEES:
- Miloslav Filka, Brno University of Technology, Czech Republic - Full Professor, TSP Conference Founder - Honorary Chair
- Norbert Herencsar, Brno University of Technology, Czech Republic - IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member - General Co-Chair
- Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataro, Tecnocampus, Spain - Dean - General Co-Chair
- Jaroslav Koton, Brno University of Technology, Czech Republic, IEEE Senior Member - Publications Chair
- Jiri Hosek, Brno University of Technology, Czech Republic, IEEE Member - Student Paper Contest Chair
- Aslihan Kartci, Brno University of Technology, Czech Republic - Publicity & Social Media Chair
- Nandor Matrai, Asszisztencia Congress Bureau, Hungary - Managing Director - Finance Chair
- Dora Kapitany, Asszisztencia Congress Bureau, Hungary - Project Manager - Registrations Chair
Steering Committee:
- Larbi Boubchir, Université Paris 8, France - Associate Professor, IEEE Senior Member
- Izzet Cem Goknar, Isik University, Turkey - Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, IEEE Life Fellow
- Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan - Full Professor, IEEE Senior Member
- Ismail Kaya, Karadeniz Technical University, Turkey
- Sridhar Krishnan, Ryerson University, Canada - Associate Dean, IEEE Senior Member
- Mario Kusek, University of Zagreb, Croatia, IEEE Member - IEEE Croatia Section Communications Chapter Chair
- Shahram Minaei, Dogus University, Turkey - Full Professor, IEEE Senior Member
- Ram M. Narayanan, The Pennsylvania State University, USA - Full Professor, IEEE Fellow
- Kimio Oguchi, Seikei University, Japan - Full Professor, IEEE Senior Member
- Serdar Ozoguz, Istanbul Technical University, Turkey - Full Professor, Associate Chair
- Jakub Peksinski, West Pomeranian University of Technology, Poland
- Hector Perez-Meana, National Polytechnic Institute, Mexico - Full Professor, IEEE Senior Member
- Vladimir Poulkov, Technical University of Sofia, Bulgaria - Dean, IEEE Senior Member
- Costas Psychalinos, University of Patras, Greece - Full Professor, IEEE Senior Member
- Markus Rupp, Vienna University of Technology, Austria - Dean, IEEE Fellow
- Zdenek Smekal, Brno University of Technology, Czech Republic - Full Professor, IEEE Senior Member
- Attila Vidacs, Budapest University of Technology and Economics, Hungary - Deputy Head of Department
- Miroslav Voznak, VŠB-Technical University of Ostrava, Czech Republic - Department Chair, IEEE Senior Member
- Drago Zagar, University of Osijek, Croatia - Dean, IEEE Senior Member
IMPORTANT DATES:
Special Session and Workshop Proposals: February 20, 2017
Full Paper Submission: February 24, 2017
Notification of Paper Acceptance: April 14, 2017
Final Paper Submission: April 28, 2017
Authors' Early Registration and Payment: May 14, 2017
Authors' Late Registration and Payment: May 24, 2017
Listeners' Registration: July 5, 2017
CONTACTS:
For more information please visit the Conference website at http://tsp.vutbr.cz/. We are also ready to answer your questions emailed to tsp-AT-feec.vutbr.cz.