MCSOC 2017 - 2017 IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip
Date2017-09-18 - 2017-09-20
Deadline2017-04-15
VenueKorea University, Seoul, South Korea
Keywords
Websitehttps://mcsoc-forum.org
Topics/Call fo Papers
The 11th IEEE MCSoC-17 (11th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip) aims at providing the world’s premier forum of leading researchers in the embedded Multicore/Many-core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper.
Program Tracks
Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.
Program Tracks
Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.
Other CFPs
- 3rd International Workshop on IoT Privacy, Trust, and Security (IoTPTS 2017)
- 6th International Conference on Genetics and Molecular Biology (ICGMB-17)
- 6th International Conference on Civil, Geology, Geography and Earth Sciences (CGGES-17)
- 6th International Conference on Bioinformatics, Biotechnology and Nano-Technology (ICBBNT-17)
- 6th International Conference on Landscape and Architectural Engineering (ICLAE-17)
Last modified: 2016-11-20 22:13:00