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EMPC 2017 - European Microelectronics and Packaging Conference
Date2017-09-10
Deadline2017-03-31
VenueWarsaw University of Technology, Poland 
KeywordsAdvanced packaging; Interconnects; Reliability
Websitehttp://www.empc2017.pl
Topics/Call fo Papers
ABSTRACTS ARE BEING REQUESTED IN THE FOLLOWING AREAS:
- Advanced packaging and interconnects
- Electronics components assembly and PCB solutions
- Materials and processes
- Printed, hybrid and flexible electronics
- Modeling, design test & reliability
- Functional systems (actuators, sensors, photovoltaics and related)
All submitted abstracts must represent original, previously unpublished work.
We look forward to welcome you to an inspiring and stimulating event.
- Advanced packaging and interconnects
- Electronics components assembly and PCB solutions
- Materials and processes
- Printed, hybrid and flexible electronics
- Modeling, design test & reliability
- Functional systems (actuators, sensors, photovoltaics and related)
All submitted abstracts must represent original, previously unpublished work.
We look forward to welcome you to an inspiring and stimulating event.
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Last modified: 2016-11-07 21:41:04