ICDEPI 2017 - 2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017)

Welcome to 2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017). ICDEPI 2017 is organized by Hong Kong Society of Mechanical Engineers (HKSME), technical sponsored by Nanyang Technological University(NTU), Hong Kong Polytechnic University. The conference will be held at Nanyang Technological University(NTU), Singapore, from Jul. 12-14, 2017!
●Publication and Indexing
1, Publishing in the Conference Proceeding.
All papers of ICDEPI 2017 will be published in the conference proceeding, which will be indexed by SCOPUS, Ei Compendex and other academic databases.
2, Publishing in International Journals.
Selected excellent papers with extension will be recommended to be published in the jounral.
●Confirmed Speakers:
1. Prof. Cees de Bont：
Affiliation: Hong Kong Polytechnic University, Hong Kong
2. Prof. Lucienne Blessing:
Affiliation: Singapore University of Technology and Design, Singapore
3. Prof. David Dornfeld:
Affiliation: Lab for Manufacturing and Sustainability (LMAS), USA
●Committee:
1. Conference Chairman
* Prof. Cees de Bont, Hong Kong Polytechnic University, Hong Kong
* Prof. Lucienne Blessing, Singapore University of Technology and Design, Singapore
2.International Technical Committee
*Prof. David Dornfeld, Lab for Manufacturing and Sustainability (LMAS), USA
*Prof. Dantan Jean-yves, Universités chez ENSAM, France
*Prof. Stefan Dimov, University of Birmingham, UK
More is to be added……
●Topics of interest for submission include, but are not limited to:
Design Processes
Design Theory and Research Methodology
Design Organization and Management
Product, Service and Systems Design
Design Information and Knowledge
Human Behavior in Design
Design Education
Design Methods and Tools
Machinery and Machine Design
Product Development and Design
Product Process Design and Management
Product Quality Management
Intelligent Product
Product Exploitation Origination Innovation
Product Structure Innovation
●Paper Submission
1, Papers can be submitted as PDF via EasyChair:
http://www.easychair.org/conferences/?conf=icdepi2...
2, You can also choose to submit your paper directly to icdepi-AT-smehk.org
3, Contributions must be written in English and report on original, unpublished work not submitted for publication elsewhere. Submissions not adhering to the above specified constraints may be rejected without review.
●CONTACT US
Ms. Amber Cao
Email: icdepi-AT-smehk.org
Website: http://www.icdepi.org