ECTC 2013 - 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are Used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards. Committee Information
The Professional Development Courses offer state-of-the-art technology reviews and updates in a condensed half-day format. Topics cover a wide range of technologies.
The Panel Discussion, Plenary Session, and CPMT seminar in the evenings offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
The Technology Corner complements the Technical Program by providing companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.
The ECTC would not be possible without the sponsorship of the IEEE Components, Packaging, and Manufacturing Technology Society, numerous corporate participants and sponsors, and the time and energies of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.