Ad Hoc 2016 - Special Issue on Three Dimensional Wireless Ad Hoc and Sensor Networks 2016
Topics/Call fo Papers
Both wireless ad hoc and sensor networks have brought us new possibilities to utilize useful information around the environments. Since most of the current research work on these networks focused on two dimensional spaces, they cannot be considered in three dimensional fields including space, atmosphere, or ocean.
While moving towards three dimensional networks, a number of important issues have to be addressed. First, the technologies used in two dimensional spaces should be modified or extended. This change ranges from the mechanism to deal with position information to communication protocols. Secondly, this modification should not hinder compatibility with nodes in existing two dimensional networks. Besides two major requirements, other research challenges including three dimensional network coverage and deployment must be carefully addressed. This special issue attracts original research and review articles on recent development and ideas in three dimensional wireless ad hoc and sensor networks. Potential topics include, but are not limited to:
? New emerging applications in three dimensional networks
? Network coverage and node placement in three dimensional networks
? MAC, routing, and transport protocol for three dimensional networks
? Targets tracking for three dimensional wireless ad hoc and sensor networks
? Synchronization and localization
? Energy efficient and power control
? Modeling and simulation
? Cooperative communications for nodes in two dimensional networks
? Networks architecture for three dimensional networks
Submission Guidelines
Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ijdsn/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijdsn/td16/ according to the following timetable:
Important Dates
Manuscript Due: Friday, 15 April 2016
First Round of Reviews: Friday, 8 July 2016
Publication Date: Friday, 2 September 2016
Lead Guest Editor
Ki-Il Kim
Department of Informatics, Gyeongsang National University, Jinju, Republic of Korea
kikim-AT-gnu.ac.kr
Guest Editors
Babar Shah
Zayed University, Dubai, UAE
Babar.Shah-AT-zu.ac.ae
Euisin Lee
Chungbuk National University, Cheongju, Republic of Korea
eslee-AT-chungbuk.ac.kr
Soo C. Park
The HKUST-NIE Social Media Lab, Hong Kong
cclab.winter-AT-gmail.com
While moving towards three dimensional networks, a number of important issues have to be addressed. First, the technologies used in two dimensional spaces should be modified or extended. This change ranges from the mechanism to deal with position information to communication protocols. Secondly, this modification should not hinder compatibility with nodes in existing two dimensional networks. Besides two major requirements, other research challenges including three dimensional network coverage and deployment must be carefully addressed. This special issue attracts original research and review articles on recent development and ideas in three dimensional wireless ad hoc and sensor networks. Potential topics include, but are not limited to:
? New emerging applications in three dimensional networks
? Network coverage and node placement in three dimensional networks
? MAC, routing, and transport protocol for three dimensional networks
? Targets tracking for three dimensional wireless ad hoc and sensor networks
? Synchronization and localization
? Energy efficient and power control
? Modeling and simulation
? Cooperative communications for nodes in two dimensional networks
? Networks architecture for three dimensional networks
Submission Guidelines
Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ijdsn/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijdsn/td16/ according to the following timetable:
Important Dates
Manuscript Due: Friday, 15 April 2016
First Round of Reviews: Friday, 8 July 2016
Publication Date: Friday, 2 September 2016
Lead Guest Editor
Ki-Il Kim
Department of Informatics, Gyeongsang National University, Jinju, Republic of Korea
kikim-AT-gnu.ac.kr
Guest Editors
Babar Shah
Zayed University, Dubai, UAE
Babar.Shah-AT-zu.ac.ae
Euisin Lee
Chungbuk National University, Cheongju, Republic of Korea
eslee-AT-chungbuk.ac.kr
Soo C. Park
The HKUST-NIE Social Media Lab, Hong Kong
cclab.winter-AT-gmail.com
Other CFPs
- 14th ACM Conference on Embedded Networked Sensor Systems (SenSys 2016)
- 24th International Conference & Exhibition on Electricity Distribution
- International Conference on Neutron Scattering
- 19th International Conference on Solid-State Sensors, Actuators and Microsystems
- Special Issue on Software Reliability Engineering
Last modified: 2016-01-04 13:58:39