MCSoC 2016 - IEEE 10th International Symposium on Embedded Multicore/Many-core Systems-on-Chip
Date2016-09-21 - 2016-09-23
Deadline2016-03-11
VenueLyon, France
Keywords
Websitehttps://mcsoc-forum.org
Topics/Call fo Papers
The IEEE 10th International Symposium on Embedded Multicore/Many-core Systems-on-Chip aims at providing the world’s premier forum of leading researchers in the embedded Multicore/Many-core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper.
Important Dates
?Paper Submission: March 11, 2016
?Acceptance notification: June 24, 2016
?Camera ready paper: July 15, 2016
?Symposium: September 21-23, 2016
Program Tracks
?Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
?Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
?Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
?Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
?Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
?Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
?Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
?Benchmarks : Parallel Benchmarks, Workload characterization and evaluation
?Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, Consumer electronics, and Novel applications.
Special Issue
Authors of selected papers from IEEE MCSoC-16 Symposium will be invited to submit extended versions of their papers to journal/transaction for inclusion in special issues (TBD).
Invited Speakers
?David Atienza , École Polytechnique Fédérale de Lausanne, Switzerland
?Andreas Hansson, ARM
?Pascal Vivet, CEA-Leti
?others (TBC)
Important Dates
?Paper Submission: March 11, 2016
?Acceptance notification: June 24, 2016
?Camera ready paper: July 15, 2016
?Symposium: September 21-23, 2016
Program Tracks
?Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
?Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
?Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
?Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
?Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
?Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
?Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
?Benchmarks : Parallel Benchmarks, Workload characterization and evaluation
?Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, Consumer electronics, and Novel applications.
Special Issue
Authors of selected papers from IEEE MCSoC-16 Symposium will be invited to submit extended versions of their papers to journal/transaction for inclusion in special issues (TBD).
Invited Speakers
?David Atienza , École Polytechnique Fédérale de Lausanne, Switzerland
?Andreas Hansson, ARM
?Pascal Vivet, CEA-Leti
?others (TBC)
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Last modified: 2015-12-13 15:24:28