REES 2015 - 2015 International Workshop on Resiliency in Embedded Electronic Systems

1st International ESWEEK Workshop
on Resiliency in Embedded Electronic Systems
October 8th, 2015
Mövenpick Hotel Amsterdam City Centre,
Amsterdam, The Netherlands
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General Co-Chairs
Daniel Müller-Gritschneder, Technical University of Munich, Germany
Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
Subhasish Mitra, Stanford University CA, USA
With the sheer complexity of hardware and software systems, resiliency became a major challenge in embedded systems design, manufacturing, and operation. For industrial applications several standards such as ISO26262, IEC61508 or DO-254 prescribe a well-defined level of reliability, robustness, and fault-tolerance.
This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows, like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.
Interested contributors are invited to submit an extended abstract with the description and the status of their work including clear references to already published articles or reports. Extended abstract are requested in PDF format following the IEEE manuscript templates for conference proceedings available at the IEEE website. Authors can upload their extended abstract (1-2 pages) in the upload section. Authors should be prepared for an oral presentation and for a discussion in front of their poster after their session. The official workshop proceedings will become available 4 weeks after the workshop. Organizers plan to organize a special journal issue for the publication of selected papers.