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VLSID 2016 - 29th IEEE International Conference on VLSI Design, 2016

Date2016-01-04 - 2016-01-08

Deadline2015-07-26

VenueKolkata, West Bengal, India India

Keywords

Websitehttps://vlsidesignconference.org

Topics/Call fo Papers

All manuscripts must be submitted for review electronically. The only accepted file format is PDF. Any other format and manuscripts received in hard-copy form will not be processed. Manuscripts should not exceed six (6) pages in length. All manuscripts should be formatted as close as possible to the final format: A4 or letter pages, double column, single spaced, Times or equivalent font of minimum 10pt. Use of colors may enhance your figures and is encouraged. Manuscripts must follow IEEE CS proceedings format (available here).
? For DOUBLE BLIND review, manuscripts should not include the author names nor affiliations.
? Severe action will be taken if any submission is found to be either plagiarised or submitted elsewhere as well.
Please submit your paper in one of the following tracks here : Paper submission
Track : Design Methodology and Technology
D1: System-level Design
ESL, System-level design methodology, Multicore systems, Processor and memory design, Concurrent interconnect, Networks-on-chip, Defect tolerant architectures
D2: Advances in Digital Design
Logic and Physical synthesis; Place & Route, Clock Tree, Physical Verification, Timing and Signal integrity, Power analysis and integrity, OCV, DFM; DFY; Challenges for advanced technology nodes
D3: Analog / RF Design
Analog Mixed Signal IP; High-Speed interfaces; SDR and wireless; Low-power Analog and RF; Effective use of Spectrum; Memory Design, Standard Cell Design
D4: Power Aware Design
Low-power design, micro-architectural techniques, thermal estimation and optimization, power estimation methodologies, and CAD tools
D5: Devices / Circuits
New Devices and architectures; Low power devices; Modeling and Simulation; Multi-domain simulation; Numerical methods; Device/circuit level variability models; Reliability simulation
D6: Emerging Technologies
Nano-CMOS technologies; MEMS; CMOS sensors; CAD/EDA methodologies for nanotechnology; Nano-electronics and Nano-circuits, Nano-sensors, MEMS applications, Nano-assemblies and Devices, Non-classical CMOS; Post-CMOS devices; Biomedical circuits, Carbon Nano-tubes based computing
Track : Design Tools and EDA
T1: Design Verification
Functional Verification; Behavioral Simulation; RTL Simulation; Coverage Driven Verification; Assertion Based Verification; Gate-level simulation; Emulation; Hardware Assisted Verification; Formal Verification; Equivalence Checking; Verification Methodologies
T2: Test Reliability and Fault-Tolerance
DFT, Fault modelling/simulation; ATPG; Low Power DFT; BIST & Repair; Delay test; Fault tolerance; Online test; AMS/RF test; Board-level and system-level test; Silicon debug, post-silicon validation; Memory test; Reliability test; static and dynamic defect- and fault-recoverability, and variation-aware design
T3: Computer-Aided Design (CAD)
Hardware/software co-design, logic and behavioral synthesis, logic mapping, simulation and formal verification, layout (partitioning, placement, routing, floorplanning, compaction)
Track : Embedded System Design and Tools
E1: Embedded Systems
Hardware/Software co-design & verification; Reconfigurable computing; Embedded multi-cores SOC and systems; Embedded software including Operating Systems, Firmware, Middleware, Communication, Virtualization, Encryption, Compression, Security, Reliability; Hybrid systems-on-chip; Embedded applications, Platforms & Case studies
E2: FPGA Design and Roconfigurable Systems
FPGA Architecture, FPGA Circuit Design, CAD for FPGA, FPGA Prototyping
E3: Wireless Systems
Wireless Sensor Networks, Low Power wireless Systems, Embedded Wireless, Wireless protocols, Wireless Power / Charging
Theme Track : Technologies for a Safe and Inclusive World
H1: Technologies for Healthcare Applications
Security/authentication based on bio-encryption techniques, Low-power ASIC design for biomedical signal processing, Ultra-low-power sensor and bio-interface design, Biomedical signal processing for multi-channel arrays such as orthogonal codes, compressive sensing, Biomedical image processing for different biometrics, Telemedicine for affordable and rural healthcare, Wireless and energy harvesting technology, Smart textiles for biomedical applications, In vivo implantable device.
H2: Technologies for Smart Management of Energy Systems
Design, synthesis and verification of smart energy system, Security and privacy for smart energy system, Big data analytics for smart energy system, Cross hardware and software layer modeling and optimization for smart energy system, Fault detection and recovery for smart energy system, Sustainability in smart energy system, Emerging applications including (but not limited to) smart grid, smart building, smart home, smart automobile, etc.
H3: Technologies for Intelligent and Secure Transportation Systems
All aspects related to building intelligent and secure transportation systems (Automotive, Aerospace, Railways, etc.) with the emphasis on Design Methodologies, Architecture and Platforms, Validation and Verification, Modeling and Simulation, Safety, Security and Reliability.
H4: Technologies for Safety Assurance of Embedded Circuits and Systems
Safety Standards - Interpretation and Adherence, Verification tools and techniques for safety in circuits and systems, Formal methods for safety assurance, Design for safety and robustness, Software and hardware architectures for safe and reliable systems.
H5: Technologies for Secure Embedded Circuits and Systems
Efficient cryptographic implementations such as lightweight and secure processors and co-processors, hardware accelerators for public-key protocols, random numbers generators, physical unclonable functions (PUFs); Side-channel and fault attacks against implementations and countermeasures; Hardware Trojan attacks and detection techniques; Secure CAD tools for embedded system design.

Last modified: 2015-06-10 23:38:34