GLSVLSI 2015 - Great Lakes Symposium on VLSI 2015

The 25th edition of GLSVLSI will be held in Pittsburgh, Pennsylvania, USA. Original, unpublished papers describing research in the general area of VLSI are solicited. Both theoretical and experimental research results are welcome. Proceedings will be published by the ACM and will be available through the ACM Digital Library.
In addition to the traditional topic areas of GLSVLSI listed below, papers are solicited for a special theme of healthcare and bioengineering, from circuits to systems. We anticipate a special issue of a journal on the same topic for which selected papers related to the special theme will be invited to submit extended versions for consideration.
Program Tracks
VLSI Design: design of ASICs, microprocessors/micro-architectures, embedded processors, analog/digital/mixed-signal systems, NoC, interconnects, memories, and FPGAs.
VLSI Circuits: analog/digital/mixed-signal circuits, RF and communication circuits, chaos/neural/fuzzy-logic circuits, high-speed/low-power circuits.
Computer-Aided Design (CAD): hardware/software co-design, logic and behavioral synthesis, logic mapping, simulation and formal verification, layout (partitioning, placement, routing, floorplanning, compaction), algorithms and complexity analysis.
Low Power and Power Aware Design: circuits, micro-architectural techniques, thermal estimation and optimization, power estimation methodologies, and CAD tools.
Testing, Reliability, Fault-Tolerance: digital/analog/mixed-signal testing, design for testability and reliability, online testing techniques, static and dynamic defect- and fault-recoverability, and variation-aware design.
Emerging Technologies & Post-CMOS VLSI: nanotechnology, molecular electronics, quantum devices, biologically-inspired computing, spintronic technology, CNT, SET, RTD, QCA, VLSI aspects of sensor and sensor networks, etc. Emphasis should be on the analysis, novel circuits and architectures, modeling, CAD tools, and design methodologies for emerging technologies.