IoT 2015 - First IEEE Internet-of-Things Symposium

The IEEE IoT Symposium is organized as a part of the Embedded Systems Week 2015
The Internet of Things (IoT) promises to revolutionize fields ranging from health care to manufacturing to personal living by connecting the Internet to physical things. Embedded computing and VLSI are central to the achievement of the IoT vision - advanced computation and communication must be delivered at extremely low energy levels and manufacturing costs. The IoT Symposium is devoted to research on advanced IoT systems.
The IoT symposium will be a part of Embedded System week, and will provide a forum for researchers, from academia and industry, to present and discuss innovative ideas and solutions related to all facets of internet-of-things.
Topics of interest at IoT Symposium include but not limited to:
- VLSI Systems Track: ultra low energy systems, integrated sensors, 3D, platform architectures.
- Networking and Communications Track: Physical layer, protocols, network management.
- Algorithms and Infrastructures Track: Distributed and cloud computing, big data methods, heterogeneous sensors, sensor fusion, standards, design methodologies.
- Security and Privacy Track: Low-energy encryption, authentication, hardware security, privacy management.
- Applications Track: Industrial control, logistics, smart homes, smart cities, office management, smart vehicles and fleets.
- Ultra-low Energy System Track: Energy harvesting, hybrid energy systems, storage-less energy systems
Organization:
Program Chairs:
Marilyn Wolf (Georgia Tech), Jason Xue (City University of Hong Kong)
Track Chairs:
- VLSI Systems Track Chair: Yuan Xie, UCSB
- Security and Privacy: Dimitrios Serpanos, Qatar Institute
- Ultra-Low Energy Systems: Hyung Guy Lee, Daegu University
- Networking and Communications: Jiang Xu, Hong Kong University of Science and Technology
- Algorithms and Infrastructures: Vijay Raghunathan, Purdue University
- Applications: Li Shang, University of Colorado
Publicity Chairs:
Habib M. Ammari, University of Michigan-Dearborn, USA
Dip Goswami, Eindhoven University of Technology
Yongpan Liu, Tsinghua University
Submission Information:
- Papers must represent original work, not published or submitted for publication in other forums.
- A double-blind review process will be enforced. Authors must not reveal their identity directly or indirectly.
- Papers must be in PDF format, not exceeding 6 pages in ACM two-column format (9pt on 8.5"x11" letter size paper). For formatting instructions and templates, visit the ACM web site. Of note, 10 pages is an upper limit. Authors are encouraged to submit shorter papers if this better fits the nature and content of the paper.
- Formal proceedings will be published in the symposium electronic proceedings and included in the IEEE Digital Library.
Any questions regarding the submission process may be directed to the TPC Co-Chairs.
Important Dates:
Jun 29, 2015: Abstract deadline
Aug 3, 2015: Acceptance notification
Sep 1, 2015: Final version due
Oct 8-9: Symposium