IFCIT 2014 - 2014 2nd International Forum on Computer and Information Technology (IFCIT 2014)
Date2014-12-28 - 2014-12-29
Deadline2014-12-01
VenueShenzhen, China
Keywords
Websitehttps://www.ifcit.org
Topics/Call fo Papers
The 2014 2nd International Forum on Computer and Information Technology (IFCIT 2014) will take place in Shenzhen, China, December 28-29, 2014. A key aspect of this conference is the strong mixture of academia and industry. This allows for the free exchange of ideas and challenges faced by these two key stakeholders and encourage future collaboration between members of these groups. This conference provides an excellent opportunity for you to update your understanding, whether you are an industry practitioner, engineering or graduate student, or academic researcher in this field.
The 1st/2013 International Forum on Computer and Information Technology (IFCIT 2013) was successfully taken place in Shenzhen, China, December 24-25, 2013. All accepted papers were published on "Applied Mechanics and Materials" journal and had been indexed into EI Compendex, Thomson ISTP and Elsevier SCOPUS databases (Click).
After refereeing process, all accepted papers will be published on international journal "Applied Mechanics and Materials" (See TTP's Conference List) and will be indexed in the major academic databases, including EI Compendex, Elsevier SCOPUS, Thomson ISI (ISTP), and other indexing services. The full text is online available via platform www.scientific.net. Selected excellent papers will be published on reputation EI/SCI journal as follows:
Open Automation and Control Systems Journal (EI COMPENDEX)
Open Electrical and Electronic Engineering Journal (EI COMPENDEX)
Sensor Letters (SCIE)
The 1st/2013 International Forum on Computer and Information Technology (IFCIT 2013) was successfully taken place in Shenzhen, China, December 24-25, 2013. All accepted papers were published on "Applied Mechanics and Materials" journal and had been indexed into EI Compendex, Thomson ISTP and Elsevier SCOPUS databases (Click).
After refereeing process, all accepted papers will be published on international journal "Applied Mechanics and Materials" (See TTP's Conference List) and will be indexed in the major academic databases, including EI Compendex, Elsevier SCOPUS, Thomson ISI (ISTP), and other indexing services. The full text is online available via platform www.scientific.net. Selected excellent papers will be published on reputation EI/SCI journal as follows:
Open Automation and Control Systems Journal (EI COMPENDEX)
Open Electrical and Electronic Engineering Journal (EI COMPENDEX)
Sensor Letters (SCIE)
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Last modified: 2014-09-22 12:52:00