RTP 2009 - 2009 17th International Conference on Advanced Thermal Processing of Semiconductors (RTP)

The RTP Conference Committee and IEEE invite you to submit abstracts for the 17th Annual IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP2009. This conference will be held in Marriott Hotel Albany, NY on September 29 to October 2, 2009. The conference provides an opportunity for members of the RTP community and academia to share their insight and learn more about Advanced Thermal Processing of Semiconductors. The conference brings together process and equipment engineers, managers, researchers and educators involved in Advanced Thermal Processing of Semiconductors.

The Conference is accompanied by a one day tutorial workshop "Metrology for ion-implant and diffusion engineering" which will be held on September 29, 2009.

The committee invites leaders in the semiconductor industry to submit papers based on all aspects of Thermal Processing of Semiconductors.



Important Dates:

Abstract Submission Deadline May 31, 2009
Abstracts Review Period June 1, 2008 - June 14, 2009
Notification of Acceptance June 14, 2009
Final Paper Submission Deadline: August 31, 2009




CALL FOR PAPERS
17th IEEE International Conference on Advanced Thermal Processing of Semiconductors
IEEE RTP 2009
Marriott Hotel Albany, NY
September 29 - October 2, 2009



Conference Chair:
Bo Lojek
ATMEL

Regional Chairs: Europe America Far East

Vittorio Privitera Jeff Gelpey Kyoichi Suguro
IMM CNR Mattson Technology Toshiba


Conference Committee:

Philippe Absil Andrew Hawryluk Jeff Gelpey Aaron Hunter
IMEC Ultratech Mattson Technology Applied Materials

Veronique Carron Michael Current Robert James Wolfgang Skorupa
CEA/LETI Current Scientific INTEL FZ-Rossendorf

Wilhelm Kegel Aomar Halimaoui Jim Nakos Kentaro Shibahara
Qimonda STMicroelectronics IBM Hiroshima University

Hiroshi Iwai Vittorio Privitera Vikram Singh Benjamin Tsai
Tokyo Inst. of Technol. IMM-CNR Varian NIST

Karuppanan Sekar Julien Venturini Masahisa Okuno Shigeru Kasai
SemEquip EXCICO Kokusai Tokyo Electron

Helen Maynard Masataka Kase Hiroshi Kiyama Satoru Muramatsu
VSEA Fujitsu Dainippon Screen NEC

Lis Nanver Andrea E. Pap Takeshi Karasawa Bunji Mizuno
TU Delft Hungarian Academy of Sciences Ushio Ultimate Junction




IEEE RTP'2009 is a conference for engineers, scientists, managers and marketing specialists working in thermal processing of semiconductors, manufacturing, simulation and equipment development. The goal is to provide a comprehensive overview of current and future directions of thermal processing technology and processing systems. The primary emphasis will be on the state-of-the-art tools and RTP and Furnace concepts and methods as they apply to commercial ULSI processing. Papers are sought in the following areas:



Thermal Processing of Nanomaterials and Nanostructures
Advanced Dielectric Formation and RTPCVD
Diffusion, Dopant Activation and Junction Formation
Application of Thermal Processes to Front and Back End Manufacturing
RTP and Advanced Thermal Processing Equipment
Temperature Measurement and Control
Heat Transfer in Microstructures
Modeling and Simulation of Thermal Processes
Strategies for RTP and Furnace Processing in the Manufacturing Environment



All submissions should include title, list of authors with affiliations, and an abstract not exceeding 300 words. Abstracts should be submitted electronically as a Microsoft Word or Adobe PDF document. To submit a paper, please follow instructions in the folder Submit Abstract. Accepted papers will be published in the archival conference proceeding, with no page limit.

DEADLINE FOR ABSTRACT SUBMISSIONS IS MAY 31, 2009.

All correspondence should be addressed to any member of the Conference Steering Committee or to:

IEEE RTP 2009 Conference
http://www.IEEE-RTP.org