ISSM 2010 - 2010 International Symposium on Semiconductor Manufacturing (ISSM)

ISSM 2009 originally scheduled for 11-13 May in Berlin, Germany in cooperation with The 20th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference(ASMC) has been cancelled.
ISSM 2010 plan to be held in Tokyo on October 18-20, 2010 as well as in the U.S. in coordination with ASMC during SEMICON West in July. Call-for-paper information is available for both conference.
ISSM 2010 in Tokyo Call-for-paper
ISSM in coordination with ASMC in July
CONTACT

ISSM Japan Office at Semiconductor Portal, Inc.

E-mail:
issm_2010-AT-semiconportal.com for further inquiries.
Phone:
+81-3-3560-3565
FAX:
+81-3-3560-3566
ABOUT ISSM

ISSM BACKGROUND

The semiconductor industry has brought about a dramatic transformation to society in the half century since the invention of the transistor. In much the same way as the revolution that brought transistors to integrated circuits, the system LSI is a concept that will bring a paradigm shift that will impact across the global semiconductor, IT and electronics related industries. With the advent of the system LSI, in addition to the importance of scaling rules based technology development, it is now essential to establish a new scheme for semiconductor manufacturing technologies in order to meet requirements for system LSIs as technologies for a ubiquitous network society.
The semiconductor industry is going through a big transition to meet this change. As an industry heavily dependent on its manufacturing capability and productivity, the industry is shifting from an integrated device manufacturing model to more horizontal specialized manufacturing processes, as well as pursuing manufacturing cost reductions with 300mm wafer transition, a step-by-step investment approach, and the introduction of customized, small/medium quantity production methods. The key words for competitive SoC manufacturing technologies are high quality, low cost, and high efficiency. Furthermore, environmental considerations are also becoming an important consideration for semiconductor manufacturing processes.
Semiconductor manufacturing technology is reliant on the sum of the total of engineers' experiences and the accumulation of know-how and IP. The complexity of the field prevents a shift to the systematization and universalization of technologies. In order to bring breakthroughs in semiconductor manufacturing to reflect changing and challenging new requirements, the International Symposium on Semiconductor Manufacturing (ISSM) was launched in 1992.
ISSM is an annual conference of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. This symposium has been held in Japan and in the U.S. on alternate years since 1992. ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM’s role has been to challenge the concept of shifting from "know-how" to "science" in semiconductor manufacturing technologies. The past twelve annual symposia have helped to shape the course of development of "manufacturing science," as well as to create new manufacturing technologies.
The Symposium is held under the joint sponsorship of the Society of Applied Physics of Japan, the IEEE Electron Devices Society, and Semiconductor Equipment and Materials International (SEMI). ISSM, with its global range, continuously pushes technological development in order to promote the discovery and utilization of innovative technologies.
ISSM's mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.
ISSM INTERESTING FACTS

ISSM 2010 will be the 19th annual conference.
The location of the conference alternates between Japan and USA each year.
The conference features key industry leaders.
The typical breakdown of our attendees includes ~80% device manufacturers and ~20% equipment suppliers.
A large percentage of our attendees are fab managers and engineers representing Manufacturing, Process, Engineering and Automation