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ICMMD 2014 - 2014 International Conference on Mechatronics and Mechanical Design

Date2014-12-26 - 2014-12-28

Deadline2014-07-10

Venue Hong Kong, Hong Kong SAR Hong Kong SAR

Keywords

Websitehttps://www.icmmd.org

Topics/Call fo Papers

2014 International Conference on Mechatronics and Mechanical Design (ICMMD 2014) will be held in Hong Kong, during December 26-28, 2014. ICMMD 2014 is a part of 2014 WORLD CONGRESS ON ELECTRONICS AND ELECTRICAL ENGINEERING (WCEEE 2014) which is sponsored by Science and Engineering Institute.
The ICMMD conference is an international forum for the presentation of technological advances and research results in the fields of Nanostructures, Nanomaterials and Nanoengineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome previous and prospected authors submit your new research papers to ICMMD Conference, and share the valuable experiences with the scientist and scholars around the world.
All full paper submissions will be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program.
All accepted papers will be published in Applied Mechanics and Materials Journal.
Applied Mechanics and Materials Journal (ISSN: 1660-9336) is Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.(copied from TTP offical website: http://www.ttp.net/1660-9336.htm

Last modified: 2014-02-28 15:28:21