EMSOFT 2014 - International Conference on Embedded Software

The International Conference on Embedded Software (EMSOFT) brings together researchers and developers from academia, industry, and government to advance the science, engineering, and technology of embedded software development. EMSOFT 2014 is part of the Embedded Systems Week. Since 2001, EMSOFT has been the premier venue for cutting-edge research in the design and analysis of software that interacts with physical processes, with a long-standing tradition for results on cyber-physical systems, which compose computation, networking, and physical dynamics.
EMSOFT 2014 (14th in the series!) is part of the Embedded Systems Week.
Program Chairs:
Tulika Mitra, National University of Singapore, Singapore
Jan Reineke, Saarland University, Germany
Areas of Interest
Design and implementation of embedded software
Formal modeling and verification
Testing and validation
Model- and component-based software design and analysis
Software technologies for safety-critical and mixed-critical systems
Software architectures for cyber-physical systems
Robust implementation of control systems
Software for distributed, networked embedded systems
Software development techniques for multi- and many-core systems
Scheduling and execution time analysis
Operating systems and middleware
QoS management and performance analysis
Energy-efficient embedded software
Embedded software security
Empirical studies and their reproduction, and confirmation
Application areas, e.g., automotive, avionics, energy, health care, mobile devices, multimedia
Submission Information
Papers should represent original work, not published or submitted for publication in other forums.
A blind review process will be enforced. Authors should not reveal authorship directly or indirectly through references.
Papers must be in PDF format and should consist of a self-contained main part which must not exceed 10 pages in ACM two-column format (9pt on 8.5"x11" letter size paper) and an optional supplement containing additional theoretical or experimental evidences that could be beneficial to the reviewer. Main paper and supplement shall be submitted in one file and together, must not exceed 20 pages in total. The supplement will not be part of the official proceedings.
For formatting instructions and templates, visit the ACM web site. Formal proceedings will be published on CD-ROM and web page forms (copyright by ACM and IEEE).