AUTOTEST 2014 - IEEE AUTOTEST
Topics/Call fo Papers
IEEE AUTOTEST (formerly known as AUTOTESTCON) is an annual technical interchange meeting sponsored by the Institute of Electrical and Electronic Engineers (IEEE). This year it celebrates 50 years in which it has gathered the military/aerospace automatic test industry together to share new technologies, discuss innovative applications, and exhibit products and services. IEEE AUTOTEST 2014 will be in St. Louis, Missouri, September 15?18, 2014.
This is a series of technical meetings whose content will be determined by the interests of those participants submitting for publication and presenting a high quality technical paper, or organizing a technical session oriented toward an appropriate topic dealing with system readiness, in general, and automatic test technology, in particular. Technical papers are now being solicited, as are proposals for technical sessions, addressing topics such as:
Artificial Intelligence in Test, ATS/TPS Management, BIT/BIST, Closed-Loop Diagnostics, Commercialization of Military Maintenance, Condition-Based Maintenance, Data Acquisition, Diagnostic Maturation, Design-For-Test, Diagnostic Strategies, Fault Tolerant Systems, Future Logistics Approaches, Information Frameworks, Interoperable Test Systems, Maintenance Architectures, Measurement Science and Uncertainty, MEMS Technology, Next Generation Test Systems, Prognostics and Health Management, Remote Diagnostics, Safety Issues, Sensor Technology, Synthetic Instruments, Test Generation, Test Requirements, Test Standards, TPS Transportability, Vehicle Health Management.
Authors are asked to submit a 500-word abstract for a proposed paper related to one of the topics above. The abstract should identify the problem to be solved, a summary of key results, and a discussion of the main contributions. Authors of accepted abstracts will then be invited to submit a full paper, which should be approximately eight to ten pages in length and identify related literature in the field. Per IEEE regulations, all submitted papers will undergo a peer review for technical content and topical suitability. Session proposals should include proposed papers/presentations and speakers. The closing date for receipt of session proposals and paper abstracts is March 15, 2014. Papers and abstracts should be submitted in electronic form using EDAS at http://www.edas.info. Please reference the website at www.ieee-autotest.com for comprehensive submission instructions.
We will conduct a student paper contest for both graduate and undergraduate student papers within the topic scope. Cash awards of $500 will be presented for the best papers in both categories plus cash awards of $400 for 2nd place papers in both categories. Please pay careful attention to all instructions for manuscript preparation and make sure the paper is identified as either a Graduate or Undergraduate Student Paper when submitting the final paper. In addition, student travel subsidies ranging from $300 to $1000 depending on student location will be provided to as many students as possible. Students must attend the meeting and present their paper in order to receive a travel subsidy or best paper award.
For Technical Program information, contact:
Timothy J. Wilmering
Technical Program Chair
The Boeing Company
PO Box 516
St. Louis, MO 63166-0516
V: 314-234-6781
E-mail: timothy.j.wilmering-AT-boeing.com
For other information contact:
Chris Clendenin
General Chair
The Boeing Company
PO Box 516
St. Louis, MO 63166-0516
V: 314-234-4788
E-mail: chris.clendenin-AT-boeing.com
† Sponsored by the IEEE Instrumentation and Measurement Society and the IEEE Aerospace Electronic Systems Society..
This is a series of technical meetings whose content will be determined by the interests of those participants submitting for publication and presenting a high quality technical paper, or organizing a technical session oriented toward an appropriate topic dealing with system readiness, in general, and automatic test technology, in particular. Technical papers are now being solicited, as are proposals for technical sessions, addressing topics such as:
Artificial Intelligence in Test, ATS/TPS Management, BIT/BIST, Closed-Loop Diagnostics, Commercialization of Military Maintenance, Condition-Based Maintenance, Data Acquisition, Diagnostic Maturation, Design-For-Test, Diagnostic Strategies, Fault Tolerant Systems, Future Logistics Approaches, Information Frameworks, Interoperable Test Systems, Maintenance Architectures, Measurement Science and Uncertainty, MEMS Technology, Next Generation Test Systems, Prognostics and Health Management, Remote Diagnostics, Safety Issues, Sensor Technology, Synthetic Instruments, Test Generation, Test Requirements, Test Standards, TPS Transportability, Vehicle Health Management.
Authors are asked to submit a 500-word abstract for a proposed paper related to one of the topics above. The abstract should identify the problem to be solved, a summary of key results, and a discussion of the main contributions. Authors of accepted abstracts will then be invited to submit a full paper, which should be approximately eight to ten pages in length and identify related literature in the field. Per IEEE regulations, all submitted papers will undergo a peer review for technical content and topical suitability. Session proposals should include proposed papers/presentations and speakers. The closing date for receipt of session proposals and paper abstracts is March 15, 2014. Papers and abstracts should be submitted in electronic form using EDAS at http://www.edas.info. Please reference the website at www.ieee-autotest.com for comprehensive submission instructions.
We will conduct a student paper contest for both graduate and undergraduate student papers within the topic scope. Cash awards of $500 will be presented for the best papers in both categories plus cash awards of $400 for 2nd place papers in both categories. Please pay careful attention to all instructions for manuscript preparation and make sure the paper is identified as either a Graduate or Undergraduate Student Paper when submitting the final paper. In addition, student travel subsidies ranging from $300 to $1000 depending on student location will be provided to as many students as possible. Students must attend the meeting and present their paper in order to receive a travel subsidy or best paper award.
For Technical Program information, contact:
Timothy J. Wilmering
Technical Program Chair
The Boeing Company
PO Box 516
St. Louis, MO 63166-0516
V: 314-234-6781
E-mail: timothy.j.wilmering-AT-boeing.com
For other information contact:
Chris Clendenin
General Chair
The Boeing Company
PO Box 516
St. Louis, MO 63166-0516
V: 314-234-4788
E-mail: chris.clendenin-AT-boeing.com
† Sponsored by the IEEE Instrumentation and Measurement Society and the IEEE Aerospace Electronic Systems Society..
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Last modified: 2014-01-25 07:44:16