TEI 2015 - Ninth International Conference on Tangible, Embedded, and Embodied Interaction
Date2015-01-31 - 2015-02-03
Deadline2014-08-01
VenueStanford, USA - United States
Keywords
Websitehttps://www.tei-conf.org/15
Topics/Call fo Papers
The work presented at TEI addresses HCI issues, design, interactive art, user experience, tools and technologies, with a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
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- The 19th International Conference on Web3D Technology
- IEEE/ACM International Symposium on Nanoscale Architectures
Last modified: 2013-11-19 00:03:40