IATA 2014 - Workshop on Integration: Applications, Technology, Architecture, Design, Automation, and Test

3D Integration is a promising technology for extending Moore’s momentum in the next decennium, offering heterogeneous technology integration, higher transistor density, faster interconnects, and potentially lower cost and time-to-market. To produce 3D chips, new capabilities are needed: process technology, architectures, design methods and tools, and manufacturing test solutions. The goal of this Workshop is to bring together researchers, practitioners, and others interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges. Previous editions of this workshop took place in conjunction with DATE 2009 to DATE 2013.