SPI 2014 - 18th IEEE Workshop on Signal and Power Integrity

The symposium will include both oral and poster sessions. In addition, a number of prominent experts will be giving keynote lectures and tutorials on areas of emerging interest. The official language is English.
TOPICS
Emerging and advanced issues
New design techniques and innovative architectures
Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization
with emphasis on:
Innovative schemes for SI and PI
Noise reduction techniques
High-speed link design and modeling
Power distribution networks
Electronic packages and microsystems
3D technologies for IC and packages
RF, microwave mixed signal packaging
Nano-interconnects and nano structures
Electromagnetic theory and modeling
Transmission line theory and modeling
Macro-modeling, reduced order models
Simulation tools for SI and PI
Electromagnetic Compatibility
Design methodology/flow
Time and frequency-domain measurements
Jitter and noise modeling
Chip-package co-design
Novel CAD concepts
Submission Format: 2 column, 4 page, PDF format only.
Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.