CEEPE 2014 - 2014 International Conference on Electronics Engineering and Power Engineering( CEEPE 2014)

2014 International Conference on Electronics Engineering and Power Engineering (CEEPE 2014). The conference will be held in Kunming, China during February 26-28, 2014. The aim objective of CEEPE 2014 is to present the latest research and results of scientists (preferred students, PhD Students, and post-doc scientist) related to Electronics Engineering and Power Engineering topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.
CEEPE2014 is supposed to be the largest technical event on Electronics Engineering and Power Engineering in Kunming China in 2014. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to CEEPE 2014.
The topics of CEEPE 2014 cover Electronics Engineering and Power Engineering and Other topics.
All papers, both invited and contributed, will be reviewed by two or three experts from the PC. After a careful reviewing process, all accepted paper will be published in international journal “Applied Mechanics and Materials”[ISSN:1660-9336, Trans Tech Publications] “Applied Mechanics and Materials” is indexed by Elsevier. Scospus and Ei Compendex (CPX), Cambridge Scientific Abstracts (CSA) , Chemical Abstracts (CA) , Google and Google Scholar, ISI (ISTP) , Institution of Electrical Engineers(IEE), etc.(For index information, please refer to AMM official website: http://www.ttp.net/1660-9336.html). The full text is online available via platform www.scientific.net. Trans Tech Publications will provide online camera-ready paper submission system.