AMEE 2014 - 2014 3rd International Conference on Applied Materials and Electronics Engineering
Date2014-04-26 - 2014-04-27
Deadline2013-12-10
VenueHong Kong, Hong Kong SAR
KeywordsMaterial Science and Technolog; Electrical Engineering; Building Materials
Websitehttps://www.iwamee.com
Topics/Call fo Papers
The 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014) will be held from April 26-27, 2014 in Hong Kong. This conference is sponsored by International Association for Scientific and High Technology and International Science and Engineering Research Center, and it is technical co-sponsored by Trans Tech Publications. The conference will continue the excellent tradition of gathering world-class researchers and engineers engaged in the fields of Applied Materials and Electronics Engineering to meet and present their latest activities. You are cordially invited to attend this interesting event.
AMEE 2012, the 1st International Conference on Applied Materials and Electronics Engineering (AMEE 2012) has successfully taken place in Hong Kong, China, January 18-19, 2012 . All accepted papers from this conference have been published on Advanced Materials Research and indexed by EI Compendex, Thomson ISTP and Elsevier SCOPUS. (EI Detail)
AMEE 2013, the 2nd International Conference on Applied Materials and Electronics Engineering (AMEE 2013) has successfully taken place in Hong Kong, China, April 19-20, 2013. All accepted papers from this conference have been published on Advanced Materials Research and indexed by EI Compendex, Thomson ISTP and Elsevier SCOPUS. (EI Detail)
AMEE 2014, All accepted papers will be published in the Advanced Materials Research (ISSN:1022-6680). (Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.)
Topic
Area 1
Material Science and Technology / 材料科学与技?
Building Materials/ 建筑材料
Nanoscience and Nanotechnology / ?米科学与技?
MEMS/NEMS / 微型/?米机?系?
Environmental Engineering and Materials Science/?境工程与材料
Civil Engineering and Materials Science/土木工程与材料
Chemical and Materials Engineering/ 化学与材料工程
Other / 其他相??域
Area 2
Electrical Engineering/?子工程
Communications and Networking/通信和网?
Sensor and Wireless Sensor Networks/?感器与?感器网?
Computer /?算机
Information Management and Information System / 信息管理和信息系?
Automatic Control / 自?控制
Mechatronics / 机?一体化
Other /其他相??域
Important Dates
Submission Due: Before December 10, 2013
Notification of Acceptance: Before December 30, 2013
Registration Due: Before January 10, 2014
Conference Date: April 26-27, 2014
AMEE 2012, the 1st International Conference on Applied Materials and Electronics Engineering (AMEE 2012) has successfully taken place in Hong Kong, China, January 18-19, 2012 . All accepted papers from this conference have been published on Advanced Materials Research and indexed by EI Compendex, Thomson ISTP and Elsevier SCOPUS. (EI Detail)
AMEE 2013, the 2nd International Conference on Applied Materials and Electronics Engineering (AMEE 2013) has successfully taken place in Hong Kong, China, April 19-20, 2013. All accepted papers from this conference have been published on Advanced Materials Research and indexed by EI Compendex, Thomson ISTP and Elsevier SCOPUS. (EI Detail)
AMEE 2014, All accepted papers will be published in the Advanced Materials Research (ISSN:1022-6680). (Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.)
Topic
Area 1
Material Science and Technology / 材料科学与技?
Building Materials/ 建筑材料
Nanoscience and Nanotechnology / ?米科学与技?
MEMS/NEMS / 微型/?米机?系?
Environmental Engineering and Materials Science/?境工程与材料
Civil Engineering and Materials Science/土木工程与材料
Chemical and Materials Engineering/ 化学与材料工程
Other / 其他相??域
Area 2
Electrical Engineering/?子工程
Communications and Networking/通信和网?
Sensor and Wireless Sensor Networks/?感器与?感器网?
Computer /?算机
Information Management and Information System / 信息管理和信息系?
Automatic Control / 自?控制
Mechatronics / 机?一体化
Other /其他相??域
Important Dates
Submission Due: Before December 10, 2013
Notification of Acceptance: Before December 30, 2013
Registration Due: Before January 10, 2014
Conference Date: April 26-27, 2014
Other CFPs
Last modified: 2013-09-27 11:15:33