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ICICTES 2014 - The International Conference on Information and Communication Technology for Embedded Systems

Date2014-01-23 - 2014-01-25

Deadline2013-10-14

VenueAyutthaya, Thailand Thailand

Keywords

Websitehttps://saki.siit.tu.ac.th/icictes2014

Topics/Call fo Papers

The International Conference on Information and Communication Technology for Embedded Systems (ICICTES2014)
January 23-25, 2014
Ayutthaya, Thailand
http://saki.siit.tu.ac.th/icictes2014
The fifth International Conference of Information and Communication Technology for Em bedded Systems (IC-ICTES 2014) is established to provide an international forum for researchers and industry practitioners to share their new ideas, original research results and practical development experiences from all embedded system-related areas including ubiquitous computing, pervasive computing, embedded system design, development of new HW/SW-related theories and techniques in embedded systems , information and communication technology for supporting development of embedded systems, and information and communication technology used in embedded systems. The conference website is at http://saki.siit.tu.ac.th/icictes2014
Topics
The conference calls for research papers reporting original investigation results of research and devel- opment on real embedded system applications and their system development. Topics in IC-ICTES 2014 are listed below, but not limited to:
A. Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, embedded microcontrollers.
B. Real-time systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design.
C. Embedded hardware support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, verifiable systems, performance modeling, validation, security issues, real-time behavior and safety critical systems.
D. Embedded software: Compilers, assemblers and cross assemblers, programming, memory man- agement, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distributed/resource aware OS, OS and middleware support.
E. Hardware/software co-design: Methodologies, test and debug strategies, real-time systems, speci- fication and modeling, design representation, synthesis, partitioning, estimation, design space explo- ration beyond traditional hardware/software boundary and algorithms.
F. Testing techniques: All aspects of testing, including design-for-test, test synthesis, built-in self-test, embedded test, for embedded and system-on-a-chip systems.
G. Application-specific processors and devices: Network processors, real-time processor, media and signal processors, application specific hardware accelerators, reconfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand-held devices, _ash memory chips.
H. Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics.
I. Embedded computing education: Curriculum issues, teaching tools and methods.
J. Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., pervasive or ubiquitous com- puting, embedded internet tools) and new principle (e.g., embedded Engineering).
K. Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion.
L. Automotive Engineering: Automotive design, new challenges on development of autoparts and automatives, safety engineering, fuel economy/emissions, vehicle dynamics, NVH engineering, auto- motive performance, shift quality, durability/corrosion engineering, package/ergonimics engineering, climate control, derivability, program timing, assembly feasibility, automotive embedded systems.
Important Dates
14 October 2013, Abstract Submission deadline
21 October 2013, Paper Submission deadline
08 December 2013, Notification of acceptance
19 December 2012, Camera-ready submission
19 December 2012, Early Registration
23-25 January 2014, Conference period
Organizing Committee
Honorary Chairs
Vudtechai Kapilakanchana, Kasetsart University
Nobuo Fujii, Tokyo Institute of Technology
Somkit Lertpaithoon, Thammasat University
Pansak Siriruchatapong, NECTEC
General Chairs (Conference Chairs)
Thanya Kiatiwat, Kasetsart University
Hiroaki Kunieda, Tokyo Institute of Technology
Somnuk Tangtermsirikul, SIIT, Thammasat University
Asanee Kawtrakul, NECTEC
Somnuk Sirisoonthorn, NSTDA
Technical Program Chairs (ICTES)
Tsuyoshi Isshiki, Tokyo Institute of Technology
Thanaruk Theeramunkong, SIIT, Thammasat University
Waree Kongprawechnon, SIIT, Thammasat University
Chalie Charoenlarpnopparut, SIIT, Thammasat University
Kanokvate Tunpimolrut, NECTEC
Kamol Kaemarungsi, NECTEC
Pisut Raphisak, Kasetsart University
Teerasit Kasetkasem, Kasetsart University
Finance Chairs
Gun Srijuntongsiri, SIIT, Thammasat University
Denchai Worasawate, Kasetsart University
Teera Phatrapornnant, NECTEC
International Advisory
Akinori Nishihara, Tokyo Institute of Technology
Local Arrangement Chairs
Boontawee Suntisrivaraporn, SIIT, Thammaset Universit
Pakinee Aimmanee, SIIT, Thammasat University
Special Session Chair
Nobuhiko Sugino, Tokyo Institute of Technology
Publicity Chairs
Srijidtra Mahapakulchai, Kasetsart University
Itthisek Nilkhamhang, SIIT, Thammasat University
Publication Chairs
Toshiaki Kondo, SIIT, Thammasat University
Siriroj Sirisukpresert, Kasetsart University
Publication Assistants
Nattapong Tongtep, SIIT, Thammasat University
Nongnuch Ketui, SIIT, Thammasat University
Webmaster
Wirat Chinnan, SIIT, Thammasat University
Supporters
National Electronics and Computer Technology Center
ECTI Association
IEEE Thailand Section
Organizers
Sirindhorn International Institute of Technology, Thammasat University (http://www.siit.tu.ac.th)
Department of Electrical Engineering, Kasetsart University (http://www.ee.ku.ac.th)
Tokyo Institute of Technology (http://www.titech.ac.jp)
More Information
Any question can be sent to process at :
Dr. Thanaruk Theeramunkong
Sirindhorn International Institute of Technology, Thammasat University, Thailand
Phone: +66-2-501-3505 ext. 2004 Fax: +66-2-501-3505 ext. 2001 Email: icictes14-AT-siit.tu.ac.th

Last modified: 2013-09-13 22:57:52