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MIS 2014 - IEEE Sensors Journal Special Issue on Material-Integrated Sensing
Topics/Call fo Papers
Deadline for submitting your proposals is 30th June 2013.
Topics
Sensors and electronics for material integration
Interfacing technologies
Reliable and robust data processing
Reliable and robust communication
Energy supply
Application scenarios
Paper submission
Paper submission must be done online here. When submitting, please indicate in the “Manuscript Type” roll-down menu, and also by e-mail to Ms. Alison Larkin a.larkin-AT-ieee.org, that the paper is intended for the “Material-integrated Sensing” Special Issue.
Topics
Sensors and electronics for material integration
Interfacing technologies
Reliable and robust data processing
Reliable and robust communication
Energy supply
Application scenarios
Paper submission
Paper submission must be done online here. When submitting, please indicate in the “Manuscript Type” roll-down menu, and also by e-mail to Ms. Alison Larkin a.larkin-AT-ieee.org, that the paper is intended for the “Material-integrated Sensing” Special Issue.
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Last modified: 2013-06-11 07:08:48