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EDI CON 2013 - Electronic Design Innovation Conference

Date2013-03-12 - 2013-03-14

Deadline2012-08-31

VenueBeijing, China China

Keywordsmicrowave; RF; high-speed digital

Websitehttp://www.ediconchina.com

Topics/Call fo Papers

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.

Last modified: 2013-02-27 01:31:03