EDI CON 2013 - Electronic Design Innovation Conference
Date2013-03-12 - 2013-03-14
Deadline2012-08-31
VenueBeijing, China
Keywordsmicrowave; RF; high-speed digital
Websitehttp://www.ediconchina.com
Topics/Call fo Papers
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
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Last modified: 2013-02-27 01:31:03