TEI 2014 - 8th International Conference on Tangible, Embedded and Embodied Interaction
Date2014-02-16 - 2014-02-19
Deadline2013-08-06
VenueMunich, Germany
Keywords
Websitehttps://www.tei-conf.org/14
Topics/Call fo Papers
TEI 2014 is the 8th international conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction.
The work presented at TEI addresses HCI issues, design, interactive art, user experience, tools and technologies, with a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
TEI is sponsored by the ACM SIGCHI
The work presented at TEI addresses HCI issues, design, interactive art, user experience, tools and technologies, with a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
TEI is sponsored by the ACM SIGCHI
Other CFPs
Last modified: 2013-02-20 07:24:51