SLIP 2013 - International Workshop on System Level Interconnect Prediction

Authors of accepted papers must sign an ACM copyright release form for their papers.
Representative technical topics include, but are not limited to:
1. Interconnect prediction and optimization at various IC design stages
2. Interconnect design challenges and system-level NoC design
3. Design and analysis of power and clock networks
4. Interconnect architecture of structural designs and FPGAs
5. Interconnect fabrics of many-core architectures
6. Design-for-manufacturing (DFM) techniques for interconnects
7. High speed chip-to-chip interconnect design
8. Design and analysis of chip-package interfaces
9. Interconnect topologies of multiprocessor systems
10. 3D interconnect design and prediction, including TSV architecture and monolithic 3D stacking
11. Emerging interconnect technologies, e.g., RF interconnects, photonic networks, carbon-based interconnects, etc.
12. Synergies between chip communication networks and networks arising in other contexts such as social networks, system biology, etc.
Workshop themes:
Keynotes
Regular paper sessions
Paper discussion panels
Interactive poster sessions
Panels on hot research topics
Embedded tutorials and invited talks