RTP 2010 - 18th International Conference on Advanced Thermal Processing of Semiconductors (RTP 2010)

CALL FOR PAPERS

18th IEEE Conference on Advanced Thermal Processing of Semiconductors
IEEE RTP 2010

Hilton University of Florida Conference Center in Gainesville
September 28 - October 1, 2010


Conference Chair:
Bo Lojek
ATMEL

Regional Chairs:
Europe America Far East
Erik Rosseel Jeff Gelpey Masayasu Tanjyo
IMEC Mattson Technology Nissin Ion Equipment
IEEE RTP'2010 is a conference for engineers, scientists, managers and marketing specialists working in thermal processing of semiconductors, manufacturing, simulation and equipment development. The goal is to provide a comprehensive overview of current and future directions of thermal processing technology and processing systems. The primary emphasis will be on the state-of-the-art tools and RTP and Furnace concepts and methods as they apply to commercial ULSI processing. Papers are sought in the following areas:


Thermal Processing of Nanomaterials and Nanostructures
Advanced Dielectric Formation and RTPCVD
Diffusion, Dopant Activation and Junction Formation
Application of Thermal Processes to Front and Back End Manufacturing
RTP and Advanced Thermal Processing Equipment
Temperature Measurement and Control
Heat Transfer in Microstructures
Modeling and Simulation of Thermal Processes
Strategies for RTP and Furnace Processing in the Manufacturing Environment

All submissions should include title, list of authors with affiliations, and an abstract not exceeding 300 words. Abstracts should be submitted electronically as a Microsoft Word or Adobe PDF document. To submit a paper, please follow instructions in the folder Submit Abstract. Accepted papers will be published in the archival conference proceeding, with no page limit.

DEADLINE FOR ABSTRACT SUBMISSIONS IS MAY 31, 2010.

All correspondence should be addressed to any member of the Conference Steering Committee or to:

IEEE RTP 2010 Conference
http://www.IEEE-RTP.org