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NFSP 2013 - The Second International Workshop on Network Forensics, Security and Privacy (NFSP 2013)

Date2013-07-08 - 2013-07-11

Deadline2013-01-15

VenuePhiladelph, USA - United States USA - United States

Keywords

Websitehttps://www.temple.edu/cis/icdcs2013

Topics/Call fo Papers

Cyberspace has been reshaped as an integration of businesses, governments and individuals, such as e-business, communication and social life. At the same time, it has also been providing convenient platforms for crimes, such as financial fraud, information phishing, distributed denial of service attacks, and fake message propagation. Especially, the emergence of social networks has raised significant security and privacy issues to the public. We have seen news of various network related security attacks from time to time, and defenders are usually vulnerable to detect, mitigate and traceback to the source of attacks. It is a new research challenge of fighting against criminals in the cyber space. The potential solutions involve various disciplines, such as networking, watermarking, information theory, game theory, mathematical and statistical modelling, data mining, artificial intelligence, multimedia processing, neural network, pattern recognition, cryptography and forensic criminology, etc.
NFSP-13 will be held at Philadelphia, USA, injunction ICDCS 2013, which is one of the top conferences in computer science.
Topics of interest include, but not limited to:
Anonymous system and forensics
IP traceback
Malware detection
Botnet identification
Networked video system
Biometric security and forensics
Emotion identification via video
Wireless network security
Game theory in network security
Data Mining for security
DDoS attacks
Virus source traceback
Malware source traceback
Botmaster traceback
Distributed systems and forensics
System security and forensics
Intrusion detection
Wireless network privacy
Information theory in network security
Multimedia in network security
Submitted papers must not substantially overlap with papers that have been published or that are simultaneously submitted to a journal or a conference with proceedings. Â All paper submissions should follow the IEEE 8.5" x 11" Two-Column Format. Long Paper submission can have 10 pages plus up to 2 over-length pages. If the paper is accepted for publication, an over-length fee will be charged to each of the over-length pages, at $200 per page in the final camera-ready version. Short Papers, on the other hand, are allowed to be up to 5 pages. Papers will be selected based on their originality, significance, relevance, and clarity of presentation assessed by at least three reviewers. Submission of a paper should be regarded as a commitment that, should the paper be accepted, at least one of the authors will register and attend the conference to present the work.
General Chairs
C.-C. Jay Kuo, University of Southern California, USA
Sherman Shen,University of Waterloo, Canada
Jie Wu, Temple University, USA
Program Chairs
Shui Yu, Deakin University, Australia
Honggang Wang, University Massachusetts Dartmouth, USA.
Xiaodong Lin, University of Ontario Institute of Technology, Canada
Sushmita Ruj, Indian Institute of Technology, India
Technical Program Committee
Bin Dai
Huazhong University of science and Technology, China
Lijuan Duan
Beijing University of Technology, China
Yong Guan
Iowa State University, USA
Sghaier Guizani
Alfaisal University, Saudi Arabia
Song Guo
University of Aizu, Japan
Honggang Hu
University of Science and Technology of China, China
Lucas Hui
The University of Hong Kong, Hong Kong
Yuming Jiang
Norwegian University of Science and Technology, Norway
Shuyuan Jin
Chinese Academy of Sciences, China
Rajgopal Kannan
Louisiana State University, USA
Chin-Feng Lai
National Ilan University, Taiwan
Lifeng Lai Worcester Polytechnic Institute, USA
Lixiang Li Beijing University of Posts and Telecommunications, China
Ming Li Utah State University, USA
Xiaodong Lin
University of Ontario Institute of Technology, Canada
Hong Liu
University of Massachusetts, Dartmouth, USA
Amiya Nayak
University of Ottawa, Canada
Yi Qian
University of Nebraska-Lincoln, USA
Abderrezak Rachedi
University Paris-Est Marne-la-Vallée, France
Bimal Roy
Indian Statistical Institute, India
Jennifer Seberry
University of Wollongong, Australia
Bo Shen
University of Massachusetts, Boston, USA
Lei Shu
Osaka University, Japan
Fabio Soldo
University of California, Irvine, USA
Yonghong Tian
Peking University, China
Kapaleeswaran (Kapali) Viswanathan
HP Labs, India
Jilong Wang
Tsinghua University, China
Yonggang Wen,
Nanyang Technological University, Singapore
Shaoen Wu,
University of Southern Mississippi, USA
Wei Wang South Dakota State University, USA
Yi Xie
Sun Yat-Sen University, China
Liudong Xing,
University of Massachusetts Dartmouth, USA
Xiang Yang
Deakin University, Australia
Xun Yi
Victoria University, Australia
Shucheng Yu
University of Arkansas at Little Rock, USA
Guofeng Zhao
Chongqing University of Posts and Telecommunication, China
Ying Zhao
Beijing University of Chemical Technology, China
Jun Zhang
Deakin University, Australia
Liang Zhou
Nanjing University of Posts and Telecommunications, China
Shijie Zhou
University of Electronic Science and Technology of China, China
Haojin Zhu
Shanghai Jiaotong University, ChinaÂ
Important Dates
Submission Deadline: Jan 15, 2013
Authors Notification: February 25, 2013
Final Manuscript Due: March 22, 2013

Last modified: 2012-12-01 12:50:08