SPLC 2013 - International Software Product Line Conference (SPLC 2013)
Topics/Call fo Papers
SPLC, the premier forum where practitioners, researchers and educators can present and discuss the most recent ideas, innovations, trends, experiences, and concerns in the area of software product lines and software product family engineering invites you to come to Tokyo Japan.
We invite a range of topics related to software product line engineering, both traditional and those that have not yet been addressed.
Special theme of SPLC 2013 is:
SPLC adoption: forms, success factors and roadblocks
These topics include but are not limited to:
Industrial experiences in product line engineering
Requirements management for product lines
Techniques and tools for product line engineering
Evolution and life-cycle issues of product line assets
Business issues for product lines
Organizational and process issues for product lines
Product Line Engineering for Globalization
Empirical studies in product line engineering
Software product lines and COTS components, open-source
Software product Lines Everywhere
Open Source SPLs
SPL and service-oriented computing
SPLs and social networks
We invite the following categories of contributions:
1. Research papers: describe original and unpublished results of empirical, conceptual, ex perimental, and theoretical research in the field of software product line engineering. We also call for short research papers, which are intended to report ideas in their early stages.
2. Vision papers: describe emerging technical/business directions relevant to software product lines and software reuse. They also describe research challenges along with possible approaches for them.
Page limit is 10 pages for full papers and 5 pages for short papers for all the categories of contributions.
Submissions should follow the ACM SIGS proceedings format and will be reviewed by at least three members of the SPLC 2013 program committee.
Important Dates:
Abstract Submission deadline: February 15th, 2013
Full paper submission deadline: February 22nd, 2013
Notification: April 13th, 2013
Program Chairs:
Stefania Gnesi
ISTI-CNR, Italy
Stanislaw Jarzabek,
National University of Singapore,
We invite a range of topics related to software product line engineering, both traditional and those that have not yet been addressed.
Special theme of SPLC 2013 is:
SPLC adoption: forms, success factors and roadblocks
These topics include but are not limited to:
Industrial experiences in product line engineering
Requirements management for product lines
Techniques and tools for product line engineering
Evolution and life-cycle issues of product line assets
Business issues for product lines
Organizational and process issues for product lines
Product Line Engineering for Globalization
Empirical studies in product line engineering
Software product lines and COTS components, open-source
Software product Lines Everywhere
Open Source SPLs
SPL and service-oriented computing
SPLs and social networks
We invite the following categories of contributions:
1. Research papers: describe original and unpublished results of empirical, conceptual, ex perimental, and theoretical research in the field of software product line engineering. We also call for short research papers, which are intended to report ideas in their early stages.
2. Vision papers: describe emerging technical/business directions relevant to software product lines and software reuse. They also describe research challenges along with possible approaches for them.
Page limit is 10 pages for full papers and 5 pages for short papers for all the categories of contributions.
Submissions should follow the ACM SIGS proceedings format and will be reviewed by at least three members of the SPLC 2013 program committee.
Important Dates:
Abstract Submission deadline: February 15th, 2013
Full paper submission deadline: February 22nd, 2013
Notification: April 13th, 2013
Program Chairs:
Stefania Gnesi
ISTI-CNR, Italy
Stanislaw Jarzabek,
National University of Singapore,
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Last modified: 2012-11-23 14:00:23