ResearchBib Share Your Research, Maximize Your Social Impacts
Sign for Notice Everyday Sign up >> Login

SISPAD 2013 - 18th International Conference on Simulation of Semiconductor Processes and Devices

Date2013-09-03 - 2013-09-05

Deadline2013-04-01

VenueGlasgow, UK - United Kingdom UK - United Kingdom

Keywords

Websitehttps://mvip2013.znu.ac.ir/

Topics/Call fo Papers

18th International Conference on Simulation of Semiconductor
The SISPAD conference series provides an open forum for the presentation of the latest results and trends in modelling and simulation of devices, processes and equipment for integrated circuits. The conference is the leading forum for Technology Computer-Aided Design (TCAD) and is held alternatingly in the United States, Japan, and Europe in September. Sispad 2013 will be held in
Glasgow, Scotland, United-Kingdom
3-5 September 2013
The deadline for abstract submission is April 1, 2013.
Topics for original contributions to the SISPAD 2013 conference include, but are not limited to:
Device simulation and modelling: Continuum, particle or quantum transport methods for electronic devices: FinFETs, ultra-thin SOI, optoelectronics devices, lasers, TFTs, micro-sensors, spintronics devices, Carbon nanotubes and graphene.
Process simulation and modelling: Continuum and/or atomistic approaches, including first-principles material design and growth simulation of nano-scale fabrication.
Compact modelling: Circuit simulation, including high frequency and high power applications.
Process/device/circuit simulation: In context with system design and verification.
Equipment, topography, lithography modeling and algorithms
Interconnect modeling and algorithms including noise and parasitic effects
Simulation of process, layout, and purely statistical variability: At TCAD, compact model and circuit level.
Advanced numerical methods and algorithms: Including grid generation, user-interface and visualization.
Fundamental aspects of device modelling and simulation: Quantum and fluctuation issues, simulation of nano-scale novel devices such as QCA, SET, quantum neural nets and molecular devices...
Sensor, biosensor and electromechanical system simulations
Abstract Submission:
Two-page abstracts (A4 size or 22x28 cm ? 1 page of text, 1 page of figures) should be submitted electronically. Detailed information about the submission process will be provided on the webpage.
Announcement of Special Events:
Two workshops will take place on Monday September 2nd 2013. Further details will be announced on the web page.

Last modified: 2012-11-14 07:34:45