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MIM 2013 - 2013 The 3rd International Conference on Mechatronics and Intelligent Materials

Date2013-05-18 - 2013-05-19

Deadline2012-12-25

VenueXiShuangBanNa, China China

KeywordsMaterials; Manufacturing Engineering; Mechatronics

Websitehttps://www.hk-ceis.com/mim2013/

Topics/Call fo Papers

2013 The 3rd International Conference on Mechatronics and Intelligent Materials
MIM 2013
XiShuangBanNa, China
May 18-19, 2013
www.hk-ceis.com/mim2013
General Information
On the successful basis of MIM 2011, 2012, 2013 The 3rd International Conference on Mechatronics and Intelligent Materials (MIM 2013) will be held in XiShuangBanNa, during May 18-19, 2013. MIM 2013 is sponsored by HongKong Control Engineering and Information Science Research Association (CEIS), International Frontiers of science and technology Research Association (IFST), National Chin-Yi University of Technology and Trans tech publications inc.
The conference is an international forum for the presentation of technological advances and research results in the fields of Mechatronics Technology and Materials Science. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome previous and prospected authors submit your new research papers to MIM 2013, and share the valuable experiences with the scientist and scholars around the world.
MIM 2013 ONLY accepts unpublished research papers. All papers, both invited and contributed, will be refereed. All accept papers will be published in international journal Advanced Materials Research (ISSN: 1022-6680) , which are online available in full text via the platform www.scientific.net. All accept papers will be indexed by EI Compendex and ISTP.
Applied Mechanics and Materials (ISSN: 1660-9366) and Advanced Materials Research (ISSN: 1022-6680) are Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.
Topics of interest include, but are not limited to:
?.Materials Engineering ?.Manufacturing Engineering
?. Mechatronics
Important Date:
Dec 25, 2013 Full manuscript submission
Jan 10, 2013 Acceptance notification
Jan 30, 2013 Conference Registration
May 18-19, 2013 Conference dates
Submisssion Methods:
Before you send the manuscript and Paper Submission Form to the 2013mim-AT-vip.163.com, Please make sure your manuscript files will have a filename "Topic field" Paper title.doc" and your paper Submission Form will have a filename "Topic field" Paper Submission Form.xls
For example:
(02) A New Co-training Approach based on SVM for Image Retrieval.doc
(02) Paper Submission Form.xls
If you have any questions, please contact us
2013mim-AT-vip.163.com
Ms. Zhong, MIM Editor, China
E-mail: 2103mim-AT-vip.163.com
Website: http://www.hk-ceis.com/mim2013
QQ Group: 1158104893
023-86238625
15823956627

Last modified: 2012-10-24 22:17:53