RSP 2012 - 23rd IEEE International Symposium on Rapid System Prototyping
Topics/Call fo Papers
The International Symposium on Rapid System Prototyping (RSP) considers prototyping as an iterative design approach for embedded hardware and software systems. The RSP series of symposium aims at bridging the gap among embedded design tools and processes, engineering methods, processes & tools, to achieve the rapid system prototyping of actual software and hardware systems,
RSP emphasizes collaborative approach toward embedded system design between industrial and academic, hardware and software communities. The symposium proposes a two-day forum for discussion with a focus on technical presentations, completed with keynote speakers and a panel discussion. For its 23rd venue, the Rapid System Prototyping Symposium seeks original contributions that address theoretical and practical methodologies, new approach for specification, completeness, dynamics of change, technology insertion, complexity, integration, and time to market.
In 2012, the RSP symposium is part of the Embedded Systems Week, in Tampere, Finland.
See http://www.esweek.org for more details.
Suggested topics include, but are not limited to:
Multiprocessor System on Chip design challenges
Embedded System Architecture Integration
Real Time embedded system challenges
Specification and Language Models for hardware/software systems
Methodologies and Tools for hardware/ software systems
Embedded System verification/validation
Design of Critical Embedded Systems
Reliability and failure analysis for embedded systems
Emerging Technologies and Applications
Quality in embedded systems design
Educational Hardware and Software Tools and Techniques
Trends in Engineering Education
Model Driven Engineering and prototyping
Virtual prototyping of physical systems
Specification to product transition
Industrial Designs
The program committee invites authors to submit original, previously unpublished full papers. Authors of selected papers will be requested to prepare a manuscript for the symposium proceedings. Paper length should not exceed 7 pages in the standard IEEE format. Submission instructions as well astemplates can be found on the RSP web site.
The program committee also invites tutorial speakers for giving lectures on RSP topics, for both academic and industrial attendees. For more detailed information, please contact the Tutorial Chair.
Important Dates:
Paper submission: June 8th, 2012
Notification of Acceptance: July 2, 2012
Final Camera Ready Manuscript due: July 27, 2012
For any submission question, please contact:
Fabiano Hessel, PUCRS ? fabiano.hessel-AT-pucrs.br
Jérôme Hugues, ISAE ? jerome.hugues-AT-isae.fr
Frédéric Rousseau, TIMA ? Frederic.Rousseau-AT-imag.fr
RSP emphasizes collaborative approach toward embedded system design between industrial and academic, hardware and software communities. The symposium proposes a two-day forum for discussion with a focus on technical presentations, completed with keynote speakers and a panel discussion. For its 23rd venue, the Rapid System Prototyping Symposium seeks original contributions that address theoretical and practical methodologies, new approach for specification, completeness, dynamics of change, technology insertion, complexity, integration, and time to market.
In 2012, the RSP symposium is part of the Embedded Systems Week, in Tampere, Finland.
See http://www.esweek.org for more details.
Suggested topics include, but are not limited to:
Multiprocessor System on Chip design challenges
Embedded System Architecture Integration
Real Time embedded system challenges
Specification and Language Models for hardware/software systems
Methodologies and Tools for hardware/ software systems
Embedded System verification/validation
Design of Critical Embedded Systems
Reliability and failure analysis for embedded systems
Emerging Technologies and Applications
Quality in embedded systems design
Educational Hardware and Software Tools and Techniques
Trends in Engineering Education
Model Driven Engineering and prototyping
Virtual prototyping of physical systems
Specification to product transition
Industrial Designs
The program committee invites authors to submit original, previously unpublished full papers. Authors of selected papers will be requested to prepare a manuscript for the symposium proceedings. Paper length should not exceed 7 pages in the standard IEEE format. Submission instructions as well astemplates can be found on the RSP web site.
The program committee also invites tutorial speakers for giving lectures on RSP topics, for both academic and industrial attendees. For more detailed information, please contact the Tutorial Chair.
Important Dates:
Paper submission: June 8th, 2012
Notification of Acceptance: July 2, 2012
Final Camera Ready Manuscript due: July 27, 2012
For any submission question, please contact:
Fabiano Hessel, PUCRS ? fabiano.hessel-AT-pucrs.br
Jérôme Hugues, ISAE ? jerome.hugues-AT-isae.fr
Frédéric Rousseau, TIMA ? Frederic.Rousseau-AT-imag.fr
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Last modified: 2012-06-02 09:36:06