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AMEE 2013 - The 2013 2nd International Conference on Applied Materials and Electronics Engineering (AMEE 2013)

Date2013-04-20

Deadline2012-11-01

VenueHong Kong, Hong Kong SAR Hong Kong SAR

Keywords

Websitehttp://www.iwamee.com/

Topics/Call fo Papers

The 2013 2nd International Conference on Applied Materials and Electronics Engineering (AMEE 2013) will be held from April 20th, 2013 in HongKong. This conference is sponsored by International Association for Scientific and High Technology and International Science and Engineering Research Center, and it is technical co-sponsored by Trans Tech Publications and Academy Publisher. The conference will continue the excellent tradition of gathering world-class researchers and engineers engaged in the fields of Applied Materials and Electronics Engineering to meet and present their latest activities. You are cordially invited to attend this interesting event.
AMEE 2012, the 1st International Conference on Applied Materials and Electronics Engineering (AMEE 2012) has successfully taken place in Hong Kong, China, January 18-19, 2012 . All accepted papers from this conference have been published on Advanced Materials Research and indexed by EI Compendex, Thomson ISTP and Elsevier SCOPUS. (EI Detail)
AMEE 2013, All accepted papers will be published in the Advanced Materials Research (ISSN:1022-6680). (Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.)
Topic
Area 1
Material Science and Technology / 材料科学与技?
Building Materials/ 建筑材料
Nanoscience and Nanotechnology / ?米科学与技?
MEMS/NEMS / 微型/?米机?系?
Other / 其他相??域
Area 2
Electrical Engineering/?子工程
Communications and Networking/通信和网?
Computer /?算机
Information Management and Information System / 信息管理和信息系?
Automatic Control / 自?控制
Mechatronics / 机?一体化
Other /其他相??域

Last modified: 2012-05-11 11:16:41