CPMT 2012 - 2012 IEEE CPMT Symposium Japan
Topics/Call fo Papers
The Leading International Components, Packaging, and Manufacturing Technology Symposium
IEEE CPMT (Components, Packaging, and Manufacturing Technology)
Symposium Japan 2012
(Formerly The VLSI Packaging Workshop in Japan)
10 ? 12 December 2012
MIYAKO-MESSE, Kyoto, JAPAN
“Heterogeneous Integration Technology toward Future”
Topics of Interest include:
+ Optoelectronics Packaging and Subsystems
+ Packaging for Automobile
+ Materials for Packaging, Wafer Process and High-Speed Application
+ Packaging for Sensors, MEMS, and Bio Devices
+ RF Components & Modules / RF Tags
+ 3D Packaging & Chip on Chip
+ Advanced Fine Pitch Packaging
+ Assembly and Packaging Challenges for Cu/Low-k Chips
+ Board-Level Integration
+ Integrated Substrate
+ Micro Bumping Technology, Wafer Level CSP
+ Laminated Materials & Processing
+ Nanotechnology, Emerging Technologies
+ Electrical Performance and Thermal Management
+ Board Level Reliability
+ Failure Mechanisms & Reliability Improvement
You are invited to submit a 500-word abstract with figures to the program chairs by e-mail. Acceptance will be noticed by 10 August 2012. You can download the abstract submission form this web . Accepted authors are requested to submit the manuscript by 25 October 2012 for the Technical Digest, which will be referred via IEEE Explore.
Abstract Due: 29 June 2012
Submit to:
Dr. Shigeru Nakagawa
IBM Research ? Tokyo
1623-14 Shimotsuruma
Yamato, Kanagawa 242-8502, JAPAN
Phone: +81-46-215-4112
E-mail: snakagw-AT-jp.ibm.com
Dr. Takashi Harada
NEC
1753 Shimonumabe
Nakahara-ku, Kawasaki, Kanagawa 211-8666, JAPAN
Phone: +81-44-435-1801
E-mail: t-harada-AT-bl.jp.nec.com
IEEE CPMT Symposium Japan
General Chair: Hiroshi Yamada (Toshiba)
Vice Chair: Shigenori Aoki
Ricky Lee (Fujitsu Laboratories, Ltd.)
(HKUST)
Program Chair: Shigeru Nakagawa
Takashi Harada (IBM Research ? Tokyo)
(NEC)
Financial Chair: Hideyuki Oh-hashi
Kenji Hirohata
(Mitsubishi Electric)
(Toshiba)
IEEE CPMT Japan Chapter
Chair: Yasuhiro Ando (Fujikura)
Vice Chair: Hiroshi Yamada (Toshiba)
Sponsors
IEEE CPMT Society
IEEE CPMT (Components, Packaging, and Manufacturing Technology)
Symposium Japan 2012
(Formerly The VLSI Packaging Workshop in Japan)
10 ? 12 December 2012
MIYAKO-MESSE, Kyoto, JAPAN
“Heterogeneous Integration Technology toward Future”
Topics of Interest include:
+ Optoelectronics Packaging and Subsystems
+ Packaging for Automobile
+ Materials for Packaging, Wafer Process and High-Speed Application
+ Packaging for Sensors, MEMS, and Bio Devices
+ RF Components & Modules / RF Tags
+ 3D Packaging & Chip on Chip
+ Advanced Fine Pitch Packaging
+ Assembly and Packaging Challenges for Cu/Low-k Chips
+ Board-Level Integration
+ Integrated Substrate
+ Micro Bumping Technology, Wafer Level CSP
+ Laminated Materials & Processing
+ Nanotechnology, Emerging Technologies
+ Electrical Performance and Thermal Management
+ Board Level Reliability
+ Failure Mechanisms & Reliability Improvement
You are invited to submit a 500-word abstract with figures to the program chairs by e-mail. Acceptance will be noticed by 10 August 2012. You can download the abstract submission form this web . Accepted authors are requested to submit the manuscript by 25 October 2012 for the Technical Digest, which will be referred via IEEE Explore.
Abstract Due: 29 June 2012
Submit to:
Dr. Shigeru Nakagawa
IBM Research ? Tokyo
1623-14 Shimotsuruma
Yamato, Kanagawa 242-8502, JAPAN
Phone: +81-46-215-4112
E-mail: snakagw-AT-jp.ibm.com
Dr. Takashi Harada
NEC
1753 Shimonumabe
Nakahara-ku, Kawasaki, Kanagawa 211-8666, JAPAN
Phone: +81-44-435-1801
E-mail: t-harada-AT-bl.jp.nec.com
IEEE CPMT Symposium Japan
General Chair: Hiroshi Yamada (Toshiba)
Vice Chair: Shigenori Aoki
Ricky Lee (Fujitsu Laboratories, Ltd.)
(HKUST)
Program Chair: Shigeru Nakagawa
Takashi Harada (IBM Research ? Tokyo)
(NEC)
Financial Chair: Hideyuki Oh-hashi
Kenji Hirohata
(Mitsubishi Electric)
(Toshiba)
IEEE CPMT Japan Chapter
Chair: Yasuhiro Ando (Fujikura)
Vice Chair: Hiroshi Yamada (Toshiba)
Sponsors
IEEE CPMT Society
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Last modified: 2012-03-18 09:06:28