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IEEE ESTC 2026 - IEEE Electronics System-Integration Technology Conference
Date2026-09-09 - 2026-09-10
Deadline2026-03-01
VenueHelsinki, Finland 
KeywordsSystem Integration; Electronics Packaging
Topics/Call fo Papers
•Advanced Packaging
• Materials for Interconnects and Packaging
• Optoelectronic Systems Packaging
• Assembly and Manufacturing Technologies
• Design Tools and Modeling
• Power Electronics System Packaging
• Advanced Technologies for Emerging Systems
• Reliability of Electronic Devices and Systems
• Flexible, Printed and Hybrid Electronics
• RF, mm-wave and THz Systems Packaging
• Materials for Interconnects and Packaging
• Optoelectronic Systems Packaging
• Assembly and Manufacturing Technologies
• Design Tools and Modeling
• Power Electronics System Packaging
• Advanced Technologies for Emerging Systems
• Reliability of Electronic Devices and Systems
• Flexible, Printed and Hybrid Electronics
• RF, mm-wave and THz Systems Packaging
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Last modified: 2025-11-07 00:04:44