EuroSimE 2026 - 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

It is our pleasure to invite you to the 27th EuroSimE Conference in the city of Warsaw, from April 19-22, 2026. As Poland’s dynamic capital, Warsaw combines centuries of history with innovation and energy. The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro/nano-electronics and microsystems. Information on abstract submission can be found below and on the submissions page.
Professional training courses will be offered on April 19, 2026 followed by three days of technical sessions (April 19–22, 2026) comprising of oral and poster presentations, including industry keynote talks by invited speakers. In addition, technical keynote talks will address pressing issues in modeling and experimentation for microelectronics and microsystems. In the accompanying exhibition suppliers of experimental characterization equipment and simulation/optimization software will showcase their latest features.
As you can see, we have given our website a light overhaul. The content from the old website, especially the papers from past conferences, will be added to this site in the weeks to come.
We look forward to seeing you in Warsaw next April!