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2025 - Therminic 2025

Date2025-09-24 - 2025-09-26

Deadline2025-04-04

Venue, Italy Italy

KeywordsThermal; Microelectronics

Websitehttps://www.conftool.pro/therminic2025

Topics/Call fo Papers

-Thermal Phenomena in Simulation & Experiment
-Electronics Cooling Concepts & Applications
-Thermo-Mechanical Reliability

Last modified: 2025-01-23 19:01:54