CAD 2012 - IEEE Transactions on CAD Special Section on Three-dimensional Integrated Circuits and Microarchitectures

IEEE Transactions on CAD
Special Section on Three-dimensional Integrated Circuits and Microarchitectures
In recent years, the area of three-dimensional (3D) Integrated Circuits has
become a very attractive research topic due to its potential for extending
MooreÕs momentum in the next decade. The key benefits of 3D ICs over
traditional two-dimensional chips include the potential of reduced overheads
for global interconnects, higher packing densities and smaller footprints,
heterogeneous integration, and faster times-to-market. To efficiently exploit
the benefits of 3D technologies, design techniques and methodologies for
supporting 3D designs are imperative; design space exploration at the
architectural level is also essential to fully take advantage of the 3D
integration technologies to build a high- performance, energy-efficient
integrated systems, GPUs, system-on-chips, heterogeneous systems, and other
integrated systems.
We are pleased to announce a call for papers for a special section of TCAD on
Three-dimensional (3D) Integrated Circuits. We welcome submissions to this
special section based on new, unpublished contributions. Submissions may also
be based on work previously published in refereed conferences/workshops; if so,
the submission must contain at least 30% new materials, and the authors must
provide a cover letter clearly stating how the submission differs from and/or
expands on the previously-published work.
Areas of interest for this special section include (but are not limited to) the
following topics:
* Physical design methodologies/tools/algorithms for 3D
* High-level synthesis/logic synthesis for 3D ICs
* ESL design methodologies and tools for 3D ICs
* Thermal analysis and thermal-aware designs
* 3D architectures and design space exploration
* 3D Test, design-for-test, and debug techniques
* Signal and power integrity, and ESD in 3D
* Chip-package co-design for 3D
* Economic benefit/cost trade-off studies
* Application, product, or test-chip case studies
Please submit your paper at the TCAD website,
http://mc.manuscriptcentral.com/tcad. Please specify "Special Section on 3D ICs
and Microarchitectures" on your cover page and in the notes section of the
Web site submission form.
IMPORTANT DATES
Submission Deadline: 15 March 2012
Acceptance Notice: 1 July 2012
Final Manuscript Due: 1 August 2012