SMEI 2024 - 2024 3rd International Conference on Simulation Modeling, Electronic Information Science and Technology (SMEI 2024)
Date2024-08-02 - 2024-08-04
Deadline2024-07-23
VenueNanjing, China
KeywordsSimulation Modeling; Electronic; Information Science
Websitehttps://ais.cn/u/vY7rUz
Topics/Call fo Papers
2024 3rd International Conference on Simulation Modeling, Electronic Information Science and Technology (SMEI 2024) will be held on August 02-04, 2024 in Nanjing, China.
Conference Website: https://ais.cn/u/vY7rUz
---Call for papers---
The topics of interest for submission include, but are not limited to:
1.Simulation Modeling
• Modelling and Simulation
• Agent-based Simulation
• Biomedical visualisation and applications
• Bond chart modelling
• Chaos modelling, control and signal transmission
---
2.Electronic Information Science and Technology
• Information Application Development and Integration Technology
• Communication and Information Systems
• Power Electronics
• Robotics
• Embedded Systems
---
---Publication---
All papers submitted to SMEI 2024 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.
---Important Dates---
Full Paper Submission Date: June 1, 2024
Notification Deadline:July 09, 2024
Final Paper Submission Date: July 16, 2024
Registration Date: July 23, 2024
Conference Date: August 02-04, 2024
--- Paper Submission---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/vY7rUz
Conference Website: https://ais.cn/u/vY7rUz
---Call for papers---
The topics of interest for submission include, but are not limited to:
1.Simulation Modeling
• Modelling and Simulation
• Agent-based Simulation
• Biomedical visualisation and applications
• Bond chart modelling
• Chaos modelling, control and signal transmission
---
2.Electronic Information Science and Technology
• Information Application Development and Integration Technology
• Communication and Information Systems
• Power Electronics
• Robotics
• Embedded Systems
---
---Publication---
All papers submitted to SMEI 2024 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.
---Important Dates---
Full Paper Submission Date: June 1, 2024
Notification Deadline:July 09, 2024
Final Paper Submission Date: July 16, 2024
Registration Date: July 23, 2024
Conference Date: August 02-04, 2024
--- Paper Submission---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/vY7rUz
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Last modified: 2024-06-27 17:59:52