ICNMS 2024 - 12th International Conference on Nano and Materials Science (ICNMS 2024)
Date2024-01-12 - 2024-01-15
Deadline2023-12-02
VenueBangkook, Thailand
KeywordsMaterials Science
Websitehttps://www.icnms.org
Topics/Call fo Papers
2024 12th International Conference on Nano and Materials Science (ICNMS 2024) will be held in Bangkok, Thailand during January 12-15, 2024.
Website:www.icnms.org
Publication
The accepted and presented papers will be included in ICNMS 2024 Conference Proceedings. The proceedings will be published by IEEE and archived in IEEE Xplore, and will be indexed by Ei Compendex and Scopus, etc.
Publication History
*ICNMS 2023 - IEEE Xplore [ISBN: 978-1-6654-8804-4]
*ICNMS 2022 - Materials Science Forum Vol.1067 [ISBN: 978-3-0364-0133-1]-Ei Compendex & Scopus indexed
*ICNMS 2021 - Key Engineering Materials Vol.891 [ISBN: 978-3-0357-1789-1]-Ei Compendex & Scopus indexed
*ICNMS 2020 - IOP Conference Series: Materials Science and Engineering Vol. 842-Scopus indexed
*ICNMS 2019 - American Institute of Physics)AIP Vol. 2083-Scopus indexed
*ICNMS 2018 - American Institute of Physics)AIP Vol. 1957-Scopus indexed
*ICNMS 2017 - Nano Hybirds and Composites (NHC)Vol. 16
*ICNMS 2016 - MATEC Vol. 43, 2016-Ei Compendex indexed
Conference Committees
*Conference Chairs
Ramesh K. Agarwal (Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE), Washington University in St. Louis, USA
Zhang Dao Hua (Fellow of SAEng, InstP, IET), Nanyang Technological University, Singapore
Steven Y. Liang (Fellow of ASME & SME), Georgia Institute of Technology, USA
*Program Committee Chairs
Jing Wang, University of South Florida, USA
Yong Suk Yang, Pusan National University, South Korea
*Program Committee Co-Chairs
Xu Chen, University of Washington, USA
Jin-Soo Park, Sangmyung University, South Korea
Kreangkrai Maneeintr, Chulalongkorn University, Thailand
*Publication Chair
Lichen Kang, Southwest Jiaotong University, China
Speakers
*Prof. Ramesh K. Agarwal (Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE)
William Palm Professor of Engineering
Washington University in St. Louis, USA
*Prof. Daohua Zhang (Fellow of SAEng, InstP, IET)
Nanyang Technological University, Singapore
*Prof. Jae-Jin Shim
Yeungnam University, South Korea
*Prof. Anja Pfennig
HTW-Berlin University of Applied Sciences, Germany
*Assoc. Prof. Basil TungLiong Wong
Swinburne University of Technology, Malaysia
Submission
* Submission System: http://confsys.iconf.org/submission/icnms2024
* Email box: icnms-AT-saise.org
Note: Full Paper is for Oral Presentation and Publication, while Abstract is only for Oral Presentation.
--For more submission guidline, you can learn through: http://www.icnms.org/submission.html
Conference Topics
* Materials behavior
* Casting and solidification
* Powder metallurgy and ceramic forming
* Surface, subsurface, and interface phenomena
* Coatings and surface engineering
* Nanomaterials and nanomanufacturing
* Biomedical manufacturing
* Environmentally sustainable manufacturing processes and systems
--Please check the link which you can find more topics: http://www.icnms.org/cfp.html
Contact Us
Conference Secretary: Ms. Evelyn Cheung
Email: icnms-AT-saise.org
Website:www.icnms.org
Publication
The accepted and presented papers will be included in ICNMS 2024 Conference Proceedings. The proceedings will be published by IEEE and archived in IEEE Xplore, and will be indexed by Ei Compendex and Scopus, etc.
Publication History
*ICNMS 2023 - IEEE Xplore [ISBN: 978-1-6654-8804-4]
*ICNMS 2022 - Materials Science Forum Vol.1067 [ISBN: 978-3-0364-0133-1]-Ei Compendex & Scopus indexed
*ICNMS 2021 - Key Engineering Materials Vol.891 [ISBN: 978-3-0357-1789-1]-Ei Compendex & Scopus indexed
*ICNMS 2020 - IOP Conference Series: Materials Science and Engineering Vol. 842-Scopus indexed
*ICNMS 2019 - American Institute of Physics)AIP Vol. 2083-Scopus indexed
*ICNMS 2018 - American Institute of Physics)AIP Vol. 1957-Scopus indexed
*ICNMS 2017 - Nano Hybirds and Composites (NHC)Vol. 16
*ICNMS 2016 - MATEC Vol. 43, 2016-Ei Compendex indexed
Conference Committees
*Conference Chairs
Ramesh K. Agarwal (Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE), Washington University in St. Louis, USA
Zhang Dao Hua (Fellow of SAEng, InstP, IET), Nanyang Technological University, Singapore
Steven Y. Liang (Fellow of ASME & SME), Georgia Institute of Technology, USA
*Program Committee Chairs
Jing Wang, University of South Florida, USA
Yong Suk Yang, Pusan National University, South Korea
*Program Committee Co-Chairs
Xu Chen, University of Washington, USA
Jin-Soo Park, Sangmyung University, South Korea
Kreangkrai Maneeintr, Chulalongkorn University, Thailand
*Publication Chair
Lichen Kang, Southwest Jiaotong University, China
Speakers
*Prof. Ramesh K. Agarwal (Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE)
William Palm Professor of Engineering
Washington University in St. Louis, USA
*Prof. Daohua Zhang (Fellow of SAEng, InstP, IET)
Nanyang Technological University, Singapore
*Prof. Jae-Jin Shim
Yeungnam University, South Korea
*Prof. Anja Pfennig
HTW-Berlin University of Applied Sciences, Germany
*Assoc. Prof. Basil TungLiong Wong
Swinburne University of Technology, Malaysia
Submission
* Submission System: http://confsys.iconf.org/submission/icnms2024
* Email box: icnms-AT-saise.org
Note: Full Paper is for Oral Presentation and Publication, while Abstract is only for Oral Presentation.
--For more submission guidline, you can learn through: http://www.icnms.org/submission.html
Conference Topics
* Materials behavior
* Casting and solidification
* Powder metallurgy and ceramic forming
* Surface, subsurface, and interface phenomena
* Coatings and surface engineering
* Nanomaterials and nanomanufacturing
* Biomedical manufacturing
* Environmentally sustainable manufacturing processes and systems
--Please check the link which you can find more topics: http://www.icnms.org/cfp.html
Contact Us
Conference Secretary: Ms. Evelyn Cheung
Email: icnms-AT-saise.org
Other CFPs
- 8th International Conference on Manufacturing Technologies (ICMT 2024)
- 6th International Conference on Electronics and Electrical Engineering Technology (EEET 2023)
- 7th International Conference on Computational Biology and Bioinformatics (ICCBB 2023)
- 5th International Conference on Advanced Bioinformatics and Biomedical Engineering (ICABB 2023)
- 8th International Conference on Biomedical Imaging, Signal Processing (ICBSP 2023)
Last modified: 2023-11-14 18:03:50