ICICM 2023 - 8th International Conference on Integrated Circuits and Microsystems (ICICM 2023)

★Full Name: 2023 The 8th International Conference on Integrated Circuits and Microsystems
★Abbreviation: ICICM 2023
**Place: Nanjing, China
**Time: October 20-23, 2023
**Website: http://icicm.net/
=Publication=
The accepted and registered papers will be publication in IEEE Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc.
***ICICM 2016-2022 has been successfully indexed by EI Compendex and Scopus already!
***ICICM 2023 has been listed in IEEE Offcial Event List.
==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Nanjing University of Posts and Telecommunications, China
==IEEE
==CAS
==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
Electronic submission system: https://easychair.org/conferences/?conf=icicm2023
Email submission: icicm_conf-AT-vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html
=Topics (include but not limit)=
► Thz and Microwave MicroSystem
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==
**Advisory Chairs
Pui-in Mak, University of Macau, Macau, China
Ljiljana Trajkovic, Simon Fraser University, Canada
**Conference Chairs
Zhigong Wang, Southeast University, China
Chen Liu, Nanjing University of Posts and Telecommunica????ons, China
Li Qiang, University of Electronic Science and Technology of China, China
**Conference Co-Chairs
Yufeng Guo, Nanjing University of Posts and Telecommunica????ons, China
Letian Huang, University of Electronic Science and Technology of China, China
**Program Chairs
Zhikuang Cai, Nanjing University of Posts and Telecommunica????ons, China
Junyong Deng, Xi'an University of Posts & Telecommunica????ons
**Program Co-Chairs
Zhixiong Di, Southwest Jiaotong University, China
Delong Shang, Ins????tute of Microelectronics of the Chinese Academy of Sciences, China
Abdel-Hamid Ali Soliman, Staffordshire University, UK
Alex Yakovlev, Newcastle University, UK
**Program Committee
Lu Zhu, Sun Yat-sen University, China
Youming Zhang, Southeast University, China
Weiguang Sheng, Shanghai Jiao Tong University, China
Haizhi Song, University of Electronic Science and Technology of China,China
Hao Gao, Austria & Eindhoven University of Technology, The Netherland
Yun Fang, Silicon Austria Labs, Austria
Jeff Kilby, Auckland University of Technology, New Zealand
**Student Program Chairs
Shiheng Yang, University of Electronic Science and Technology of China, China
Chao Fan, Xi'an Jiaotong University, China
**Special Session Chairs
Chen Yang, Xi'an Jiaotong University, China
Jianshi Tang, Tsinghua University, China
Yuan Du, Nanjing University, China
**Academic Committee Chairs
Jin He, Peking University, China
Fanyi Meng, Tianjin University, China
**Academic Committee
Kailin Ren, Shanghai University, China
Yuanyuan Shi, University of Science and Technology of China, China
Minghui Li, University of Glasgow, UK
Wang Nan, Dalian University of Technology, China
Wu Gao, Northwestern Polytechnical University, China
**Publicity Chairs
Huizhen Qian, University of Electronic Science and Technology of China, China
Qiang Wu, Southwest Jiaotong University, China
Jia Wang, Northwestern Polytechnical University, China
Dengquan Li, Xidian University, China
Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi, Thailand
Wei Ren, Xi’an University of Posts and Telecommunications, China
=CONTACT US=
Ms. Jenny Chow
Email: icicm_conf-AT-vip.163.com
Web: http://icicm.net/
Tel: (86)136-2777-7774