ICICTES 2012 - Third International Conference on Information and Communication Technology for Embedded Systems

The Third International Conference on Information and Communication
Technology for Embedded Systems
VIE Hotel, Bangkok, Thailand 22-24 March 2012
URL: http://www.icictes2012.org/
CALL FOR PAPER
The Third International Conference of Information and Communication
Technology for Embedded Systems (IC-ICTES 2012) is established to
provide an international forum for researchers and industry
practitioners to share their new ideas, original research results and
practical development experiences from all embedded system-related
areas including ubiquitous computing, pervasive computing, embedded
system design, development of new HW/SW-related theories and
techniques in embedded systems, information and communication
technology for supporting development of embedded systems, and
information and communication technology used in embedded systems.
AREAS OF INTEREST
The conference calls for research papers reporting original
investigation results of research and development on real embedded
system applications and their system development. Topics in IC-ICTES
2012 are listed below, but not limited to:
A. Embedded system architecture: Multiprocessors, reconfigurable
platforms, memory management support, communication, protocols,
network-on-chip, real-time systems, embedded microcontrollers.
B. Real-time systems: All real-time related aspects such as software,
distributed real-time systems, real-time kernels, real-time OS, task
scheduling, multitasking design.
C. Embedded hardware support: System-on-a-chip, DSPs, hardware
specification, synthesis, modeling, simulation and analysis at all
levels for low power, power-aware, testable, reliable, verifiable
systems, performance modeling, validation, security issues, real-time
behavior and safety critical systems.
D. Embedded software: Compilers, assemblers and cross assemblers,
programming, memory management, object-oriented aspects, virtual
machines, scheduling, concurrent software for SoCs,
distributed/resource aware OS, OS and middleware support.
E. Hardware/software co-design: Methodologies, test and debug
strategies, real-time systems, specification and modeling, design
representation, synthesis, partitioning, estimation, design space
exploration beyond traditional hardware/software boundary and
algorithms.
F. Testing techniques: All aspects of testing, including
design-for-test, test synthesis, built-in self-test, embedded test,
for embedded and system-on-a-chip systems.
G. Application-specific processors and devices: Network processors,
real-time processor, media and signal processors, application specific
hardware accelerators, reconfigurable processors, low power embedded
processors, bio/fluidic processors, Bluetooth, hand-held devices, _ash
memory chips.
H. Industrial practices and benchmark suites: System design, processor
design, software, tools, case studies, trends, emerging technologies,
experience maintaining benchmark suites, representation, interchange
format, tools, copyrights, maintenance, metrics.
I. Embedded computing education: Curriculum issues, teaching tools and
methods.
J. Emerging new topics: New challenges for next generation embedded
computing systems, arising from new technologies (e.g.,
nanotechnology), new applications (e.g., pervasive or ubiquitous
computing, embedded internet tools) and new principle (e.g., embedded
Engineering).
K. Embedded System Applications: All ranges of applications on
embedded system, including speech processing, image processing,
network computing, distributed computing, parallel computing and power
conversion.
L. Automotive Engineering: Automotive design, new challenges
on development of autoparts and automatives, safety engineering, fuel
economy/emissions, vehicle dynamics, NVH engineering, automotive
performance, shift quality, durability/corrosion engineering,
package/ergonomics engineering, climate control, derivability, program
timing, assembly feasibility, automotive embedded systems.
IMPORTANT DATES
Submission deadline: 23 January 2012
Notification of acceptance: 6 February 2012
Camera-ready submission 20 February 2012
Early registration 20 February 2012
Conference 22-24 March 2012
PAPER SUBMISSION
Proceedings will be published by TAIST Tokyo Tech Program, National
Science and Technology Development Agency (NSTDA). The first page
should include the paper title, the names and the complete mailing
addresses of all authors, and the e-mail address of the corresponding
author. Each paper should consist of up to 200-word abstract, up to 5
keywords. All the text, figures and reference must be between 4-6
double-column A4 pages with font size of 10 points. Authors MUST use
IEEE manuscript submission guidelines (available at
http://www.ieee.org/authors.html) for their initial submissions. All
papers must be submitted electronically in PDF format only, using the
conference management tool. The submitted papers must not be published
or under consideration to be published elsewhere.
For further information, Please contact
Thanaruk Theeramunkong
Sirindhorn International Institute of Technology,
Thammasat University, Thailand
Tel: +66-2-501-3505 ext. 2004
Fax: +66-2-501-3505 ext. 2001
Email: icictes12 at siit.tu.ac.th