APM 2011 - International Symposium on Advanced Packaging Materials (APM）

International Symposium on Advanced Packaging Materials (APM）is not only the biggest event on micro-electronic packaging materials all over the world but also an international premier technical event on electronic packaging materials. The symposium mainly focuses on advanced semiconductor materials, micro-nano electronic packaging materials, advanced electronic packaging technologies included package reliability, thermal solutions and so on. Attendees in the past have included academic researchers, developers, producers, and users of packaging materials from all over the world. The symposium is also a major packaging materials forum, providing opportunities to network and meet leading experts and exchange up-to-date packaging knowledge in the field.

APM conferences have been held in United States since 1996 and APM 2010 was held in United Kingdom. APM 2011 is scheduled for October 25 to 28, 2011, Xiamen, China, organized by the IEEE’s Components Packaging and Manufacturing Technology (CPMT) Society and Xiamen University (XMU), undertaken by College of Materials at XMU, Darbond Technology Co., Ltd., Beijing Faith Information Consulting Co., Ltd. It is estimated that more than 300 researchers, producers, developers from all over the world will attend this international premier technical event.