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TSP 2030 - Tech Science Press 出版社 SCIE EI Journals期刊

Date2030-10-22 - 2030-10-24

Deadline2030-10-16

VenueWuhan, China China

KeywordsTech Science Press; SCIE EI Journals期刊; EI、Scopus

Websitehttps://www.researchi.org

Topics/Call fo Papers

Tech Science Press 出版社 SCIE EI Journals 期刊
SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex 期刊
SCIE EI Journals 期刊
CMES-Computer Modeling in Engineering & Sciences
ISSN: 1526-1492 (print)
ISSN: 1526-1506 (online)
CMC-Computers, Materials & Continua
ISSN: 1546-2218 (print)
ISSN: 1546-2226 (online)
FDMP-Fluid Dynamics & Materials Processing
ISSN: 1555-256X (print)
ISSN: 1555-2578 (online)
Molecular & Cellular Biomechanics
ISSN: 1556-5297 (print)
ISSN: 1556-5300 (online)
与国内外部分高校,外企,科研机构有会议合作关系 每月均会提交会议论文至不同出版社出版,与多家世界知名出版集团建立了良好的合作关系,如IEEE Press, IEEE CS CPS, Springer, Elsevier, IOP, Academic Press, ASME, American Scientific Publishing, SPIE, CRC Press / Balkema, DEStech Publications, TTP and Atlantis Press等, 且可推荐优秀学术论文至知名国际期刊发表.
欢迎广大社会工作者、教育工作者、研究生、博士生提交论文与合作 针对高校和个人作者一次性投稿多篇文章后, 后续作者在本中心投稿的文章费用 按照之前的多篇文章最低价格优惠
SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex/ SJR / PubMed Journal list
Website:https://blog.researchi.org/jcr/ http://www.researchi.org/
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Last modified: 2021-10-14 11:07:05