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CPCW 2011 - 2011 IEEE 1st International Workshop on Chip-Packaging Co-Design for High Performance Electronic Systems (CPCW)



VenueSanta Clar, USA - United States USA - United States



Topics/Call fo Papers

The workshop is aimed at systems, signal integrity, power integrity, circuit design, and reliability engineers/managers wishing to better understand challenges and solutions in system design, manufacturing, and qualification. Attendance is limited, and the venue provides a good atmosphere for networking during the sessions, coffee breaks, and buffet lunches.

Last modified: 2011-08-31 12:42:26