CPCW 2011 - 2011 IEEE 1st International Workshop on Chip-Packaging Co-Design for High Performance Electronic Systems (CPCW)
VenueSanta Clar, USA - United States
Topics/Call fo Papers
The workshop is aimed at systems, signal integrity, power integrity, circuit design, and reliability engineers/managers wishing to better understand challenges and solutions in system design, manufacturing, and qualification. Attendance is limited, and the venue provides a good atmosphere for networking during the sessions, coffee breaks, and buffet lunches.
Last modified: 2011-08-31 12:42:26